VCSEL Planar Lightwave Circuit Layout for Heat and Light Coupling
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Solution Overview
Problem
Existing light source devices face challenges in achieving good heat dissipation and efficient light collection, particularly when integrating vertical-cavity surface-emitting laser elements with planar lightwave circuits.
Innovation Solution
A light source device is designed with a substrate that supports multiple vertical-cavity surface-emitting laser elements and a planar lightwave circuit, where the laser elements are electrically and thermally connected to improve heat dissipation, and the planar lightwave circuit is optimized for efficient light waveguiding and collection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vertical-cavity surface-emitting laser elements are integrated with planar lightwave circuits, then light collection efficiency is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The substrate is divided into a light-emitting element mounting region and a heat dissipation region. The heat dissipation region includes a heat dissipation layer with higher thermal conductivity positioned beneath the light emitting elements, while the light collection region uses a planar lightwave circuit with optimized waveguide structures. This segmentation allows independent optimization of heat dissipation and light collection functions in different spatial zones.
Solution Approach 2:
A dedicated heat dissipation layer is introduced as an intermediary component between the light emitting elements and the substrate. This heat dissipation layer has higher thermal conductivity than the substrate and serves as a thermal bridge to efficiently conduct heat away from the light emitting elements, resolving the heat dissipation issue while maintaining the integrated structure for light collection.
2Power
If multiple light emitting elements are arranged on the substrate, then light output capacity increases, but thermal management becomes more difficult
Solution Approach 1:
The substrate surface is segmented into distinct functional regions: a light-emitting element mounting region where multiple laser elements are arranged for high light output, and a separate heat dissipation region with enhanced thermal conductivity materials and structures. This spatial segmentation allows multiple high-power elements to operate simultaneously while heat is efficiently managed through the dedicated heat dissipation pathways.
Solution Approach 2:
The substrate structure employs composite material design, combining materials with different thermal conductivities in specific configurations. The heat dissipation region uses materials with higher thermal conductivity (such as metal layers or thermally conductive ceramics) while the light emission region uses materials optimized for optical properties. This composite structure enables both high light output from multiple elements and effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation properties and improves light collecting characteristics, leading to a more efficient and compact light source device with improved stability and performance.
Implementation Method 1
The light emitting elements disposed on the support face include a first light emitting element and a second light emitting element, each a vertical-cavity surface-emitting laser element
Implementation Method 2
The planar lightwave circuit has a light incident face that faces the support face and a plurality of optical waveguides that allow light exiting from the light emitting elements to enter the light incident face to be respectively waveguided
Data Source
AI summary
A light source device includes: a substrate having a support face; a plurality of light emitting elements disposed on the support face, the plurality of light emitting elements including a first light emitting element and a second light emitting element, each of which is a vertical-cavity surface-emitting laser element; and a planar lightwave circuit having a light incident face that faces the support face and including a plurality of optical waveguides configured to guide light that has exited from the respective plurality of light emitting elements and entered the light incident face. The planar lightwave circuit is directly or indirectly supported by the plurality of light emitting elements. The substrate includes a first wiring layer electrically connected to the first light emitting element and the second light emitting element.