Vee Dipole Antennas on PCB with Resistive Loading
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Solution Overview
Problem
Current radar systems face challenges in being better, faster, smaller, lighter, more accurate, reliable, and rugged due to issues with antenna geometry, signal reflections, and manufacturing complexity.
Innovation Solution
A radar system design featuring a printed circuit board with integrated transmitter or receiver circuitry and vee dipole antennas with discrete resistive loading, eliminating the need for separate transmission lines and allowing for controlled signal properties and reduced noise by integrating all components on a single board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional separate transmission lines and antenna structures are used, then signal transmission is achieved, but reflection artifacts increase and noise increases
Solution Approach 1:
The patent integrates the antenna elements directly into the printed circuit board trace structure, merging the transmission line and antenna into a single integrated component. This eliminates separate transmission lines and reduces reflection artifacts by removing discontinuities between separate components.
Solution Approach 2:
The patent extracts the antenna function from separate physical components and embeds it directly into the PCB trace structure, eliminating the need for discrete transmission lines and reducing the sources of reflection and noise.
2Volume of moving object
If miniaturized antenna structures are used, then system size is reduced, but manufacturing complexity increases
Solution Approach 1:
The antenna elements are merged with the PCB trace structure, allowing the radar system to be miniaturized without increasing manufacturing complexity. The same PCB fabrication process that creates traces also creates the antenna elements, eliminating the need for separate antenna manufacturing steps.
Solution Approach 2:
The PCB trace structure serves multiple functions: it provides electrical connections, structural support, and antenna radiation elements. This multi-functionality enables miniaturization while maintaining ease of manufacture through standard PCB fabrication processes.
3Reliability
If integrated PCB design is used, then noise is reduced and reliability improves, but component integration complexity increases
Solution Approach 1:
The transmitter, receiver, and antenna elements are merged into a single integrated PCB design, reducing noise by eliminating external connections and improving reliability. The integration is achieved through standard PCB fabrication techniques rather than complex assembly processes.
Data Source
AI summary
Time domain radar signals are transmitted and received from vee dipole antennas on circuit boards. The antennas are formed by spaced deposited copper pads and discrete surface mount resistors soldered between the copper pads. The antenna feed-points are connected directly to adjacent transmitting and receiving circuits on the same printed circuit board. Traces are printed on a middle layer of a strip of printed circuit board. Vias connect ground planes on opposite sides. Artifacts are reduced, and signal properties are controlled.