Vehicle air-conditioning device using semiconductor as cooling core
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Solution Overview
Problem
Traditional vehicle air-conditioning systems rely on bulky and heavy compressors that generate noise and consume significant electrical power, making them inefficient for use in automobiles, where a lighter, more compact solution is needed to improve energy efficiency and reduce noise.
Innovation Solution
A vehicle air-conditioning device utilizing a semiconductor as a cooling core, comprising thermoelectric cooling chips, a tube-winding circulation box with heat transfer fins, an electric water pump, and a power-supplying and temperature-controlling device, which eliminates the need for a compressor by using fans to circulate air and an electric water pump to enhance heat dissipation, while incorporating a temperature-reduction transfer bar and aluminum alloy conducting plates for improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a compressor is used in the air-conditioning system, then sufficient cooling performance is achieved, but the system becomes bulky, heavy, and energy-consuming
Solution Approach 1:
The patent replaces the mechanical compressor system with a semiconductor thermoelectric cooling system. The thermoelectric cooling chip uses electrical current to directly generate cooling effect through the Peltier effect, eliminating the need for mechanical compression, moving parts, and refrigerant circulation mechanisms. This substitution dramatically reduces system weight while maintaining adequate cooling performance for vehicle applications.
Solution Approach 2:
The patent changes the operating parameters and mechanism of the cooling system from mechanical compression-based to electrical field-based thermoelectric effect. By applying electrical voltage across the thermoelectric chip, the system generates a temperature difference directly without mechanical movement, thereby achieving weight reduction while preserving cooling functionality.
2Temperature
If a compressor is used in the air-conditioning system, then sufficient cooling performance is achieved, but noise generation increases
Solution Approach 1:
The patent eliminates the mechanical compressor and its associated moving parts, replacing them with a solid-state thermoelectric cooling chip. This substitution removes the primary noise source generated by mechanical compression, valve operation, and refrigerant flow turbulence, resulting in a significantly quieter air-conditioning system suitable for vehicle environments.
3Temperature
If a compressor is used in the air-conditioning system, then sufficient cooling performance is achieved, but electrical power consumption increases
Solution Approach 1:
The patent replaces the high-power mechanical compressor with a low-power thermoelectric cooling chip. The thermoelectric system consumes electrical energy directly to generate the Peltier effect, which creates the cooling effect. This eliminates the energy losses associated with mechanical efficiency, friction, and refrigerant compression, resulting in significantly reduced electrical power consumption while maintaining cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a lightweight, compact, and energy-efficient air-conditioning system that reduces noise and improves cooling efficiency within vehicles by leveraging thermoelectric cooling and advanced heat transfer mechanisms, eliminating the drawbacks of traditional compressor-based systems.
Implementation Method 1
making use of the property of a thermoelectric cooling chip that causes heating at one end and cooling at an opposite end when working with a supply of electricity
Implementation Method 2
a tube-winding circulation box having a surface on which heat transfer fins are distributed, a fan
Implementation Method 3
incorporating a temperature-reduction transfer bar and aluminum alloy conducting plates for improved cooling efficiency
Data Source
AI summary
Disclosed is a vehicle air-conditioning device using semiconductor as a cooling core, including a thermoelectric cooling chip, a cooling circulator, a heat dissipation device, and a power-supplying and temperature-controlling device. The thermoelectric cooling chip has an electricity receiving end electrically connected to the power-supplying and temperature-controlling device to receive electricity therefrom to be energized as to have an end thereof forming a cold generating surface adjacent to the cooling circulator and an end opposite to the cold generating surface forming a heat generating surface adjacent to the heat dissipation device. The cooling circulator includes a tube-winding circulation box including temperature-reduction conducting fins distributed on a surface, a temperature-receiving water tank, a temperature-receiving conducting plate, a fan, and an assistive temperature transferring device including an electric water pump. The tube-winding circulation box is connected through piping to the temperature-receiving water tank that is stacked with the temperature-receiving conducting plate.