Vehicle Controller Cooling Layout for IGBT Heat and EMC Isolation
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Solution Overview
Problem
Existing vehicle controllers suffer from poor heat dissipation and electromagnetic compatibility due to a small cooling water channel space and improper layout, leading to ineffective heat exchange and interference between the IGBT module and power supply module.
Innovation Solution
A vehicle controller with double layers of control cooling water channels, including an IGBT cooling layer and a power supply cooling layer stacked in the thickness direction, separated by a transition section, with separate processing and sealing to enhance heat dissipation and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer cooling water channel is used in the control box, then the structure is simple, but the water channel space is small and heat dissipation efficiency is poor
Solution Approach 1:
The patent transitions from a single-layer cooling water channel to a double-layer stacked structure in the thickness direction of the control box. The first cooling water channel is arranged on the first side of the control box, while the second cooling water channel is arranged on the second side, creating a three-dimensional layered configuration that increases water channel space and heat exchange area without significantly complicating the overall structure.
2Volume of stationary object
If the IGBT module and power supply module are disposed close to each other, then the control box size is reduced, but electromagnetic compatibility deteriorates
Solution Approach 1:
The patent divides the control box into functionally independent regions by arranging the IGBT module and power supply module on opposite sides. The first cooling water channel is dedicated to cooling the IGBT module on the first side, while the second cooling water channel cools the power supply module on the second side. This spatial segmentation reduces electromagnetic interference between the two modules while maintaining a compact overall structure.
3Device complexity
If a single cooling water channel is used for both IGBT module and power supply module, then the structure is simplified, but heat exchange area is insufficient
Solution Approach 1:
The patent employs a double-layer cooling water channel structure where the first cooling water channel and second cooling water channel are stacked in the thickness direction of the control box. This three-dimensional arrangement doubles the heat exchange area between the cooling water channels and the heat-generating components, ensuring sufficient cooling capacity for both the IGBT module and power supply module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a large water channel space, high heat dissipation efficiency, and improved electromagnetic compatibility by increasing the heat exchange area and reducing interference between components.
Implementation Method 1
the IGBT module extending into the IGBT cooling layer and being cooled by coolant in the IGBT cooling layer
Implementation Method 2
the power supply module being adjacent to the power supply cooling layer and cooled by coolant in the power supply cooling layer
Implementation Method 3
The vehicle controller is configured to dissipate heat of the IGBT module and the power supply module by disposing a cooling water channel in the control box
Data Source
AI summary
A vehicle controller includes: a control box having a first outer surface and a second outer surface disposed opposite to each other in a thickness direction of the control box, the first outer surface including a control cooling water channel, which includes an Insulated Gate Bipolar Transistor (IGBT) cooling layer, a power supply cooling layer, and a transition section, and the IGBT cooling layer and the power supply cooling layer stacked in the thickness direction of the control box and communicated to each other by using the transition section; an IGBT module mounted on the first outer surface and extending into the IGBT cooling layer and being cooled by coolant in the IGBT cooling layer; and a power supply module mounted on the second outer surface and the power supply module adjacent to the power supply cooling layer and cooled by coolant in the power supply cooling layer.