Vehicle Heat Management Paths for Cooling and Heat Utilization
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Solution Overview
Problem
Existing heat management systems in vehicles primarily focus on heat dissipation management and do not adequately address heat generation management, leading to inefficient use of heat generated by semiconductor devices.
Innovation Solution
A heat management system that includes a heat generation portion with multiple heat dissipation paths, where one path increases heat dissipation with temperature rise, allowing for effective heat dissipation and utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation management is prioritized using conventional single-path systems, then cooling efficiency is improved, but heat generation management capability deteriorates
Solution Approach 1:
The heat dissipation system is divided into multiple independent heat dissipation paths (first heat dissipation path and second heat dissipation path), each capable of operating independently or in combination. This segmentation allows the system to selectively activate different paths based on whether heat dissipation or heat generation management is the primary objective, thereby resolving the contradiction between cooling efficiency and heat generation management capability.
Solution Approach 2:
The system dynamically adjusts the heat dissipation amount through the second heat dissipation path based on the temperature rise of the heat generation portion. When temperature increases, the heat dissipation amount through the second path increases, enabling adaptive response to thermal conditions and allowing the system to switch between cooling-dominated and heat-recovery-dominated modes as needed.
2Temperature
If heat is dissipated aggressively from the heat generation portion, then temperature control is improved, but heat utilization efficiency deteriorates
Solution Approach 1:
Different heat dissipation paths are designed with different thermal characteristics. The first heat dissipation path provides baseline heat dissipation, while the second heat dissipation path is specifically configured to increase heat dissipation amount in response to temperature rise. This local differentiation in thermal management strategy allows the system to maintain temperature control while capturing and utilizing heat that would otherwise be wasted, particularly through the temperature-dependent activation of the second path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables appropriate performance of both heat dissipation and heat generation management, enhancing cooling efficiency when temperatures are high and promoting heat utilization when temperatures are low.
Implementation Method 1
a first heat dissipation path configured to transfer heat from the heat generation portion to another portion other than the heat generation portion
Implementation Method 2
A heat dissipation amount of the heat generation portion through the second heat dissipation path increases along with a temperature rise of the heat generation portion
Data Source
AI summary
The heat management system includes a power semiconductor (heat generation portion). The power semiconductor has a heat dissipation path. The heat dissipation path is configured to transfer heat from the power semiconductor to other portions than the power semiconductor. As the temperature of the power semiconductor increases, the amount of heat dissipation of the power semiconductor through the heat dissipation path increases.