Vehicle Lamp Socket Layout for LED Heat Isolation
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Solution Overview
Problem
Existing light source units for vehicle lamps hinder the further improvement of luminous efficiency of semiconductor light-emitting elements due to heat interference from the drive circuit, despite the substrates being separated.
Innovation Solution
The light source unit integrates the semiconductor light-emitting elements and power supply members as a socket structure, while the control circuit is configured separately, allowing effective heat shielding and increased current supply to the elements, enhancing luminous efficiency and reducing the socket size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the light-emitting element and drive circuit are separated onto different substrates, then the light-emitting element is separated from heat of the drive circuit and luminous efficiency is improved, but the first substrate and second substrate are integrally incorporated in a socket which allows heat transfer and hinders further improvement of luminous efficiency
Solution Approach 1:
The drive circuit is extracted from the socket structure and mounted separately on the housing, completely isolating it from the light-emitting element and its heat source. This extraction eliminates the heat transfer path through the socket, allowing the light-emitting element to operate in a thermally isolated environment while the drive circuit handles electrical functions independently.
Solution Approach 2:
The system is segmented into three independent modules: the light-emitting element on its substrate, the drive circuit on a separate substrate mounted on the housing, and the socket connecting only the light-emitting element. This segmentation prevents thermal coupling between the drive circuit and light-emitting element while maintaining electrical connectivity where needed.
2Loss of energy
If the control circuit is configured separately from the light source, then heat shielding is improved and luminous efficiency increases, but device complexity increases
Solution Approach 1:
The socket is designed to integrate multiple functions: mechanical mounting of the light-emitting element, electrical connection through contacts, and thermal management through heat dissipation structures. By merging these functions into a single component, the design reduces overall system complexity despite the separate positioning of the drive circuit.
3Illumination intensity
If current supply to the light-emitting element is increased to improve luminous efficiency, then brightness increases but heat generation increases affecting performance
Solution Approach 1:
The heat generated by the light-emitting element during high-current operation is converted into a beneficial thermal management opportunity. The socket's heat dissipation structures and the separated drive circuit configuration work together to channel and remove this heat effectively, allowing the system to operate at higher currents for improved brightness without suffering from thermal degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases luminous efficiency by up to 20% and reduces socket size, while allowing the use of existing control circuits, thus lowering manufacturing costs and enabling combination with different lamp functions.
Implementation Method 1
a heat radiating member (24)
Implementation Method 2
a plurality of semiconductor light-emitting elements (LED1 and LED2) are mounted on a front surface of the substrate (3)
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The present invention enables further improvement of luminous efficiency of a semiconductor light-emitting element. In the present invention, a mounting member, a substrate, two semiconductor light-emitting elements, and three terminals are configured as a socket which is an integral structure, while a control circuit is configured separately from the socket. As a result, in the present invention, the control circuit is separated from the substrate of the socket, and therefore it becomes possible to further improve the luminous efficiency of the semiconductor light-emitting elements.