Vehicle Lamp Triangular LED Arrays for Brightness Uniformity
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Solution Overview
Problem
Current vehicle lamps using packaged LEDs face challenges with low mass production yield rates, high fabrication costs, and limited flexibility, prompting the need for surface light sources configured as semiconductor light emitting devices to achieve various shapes and improved brightness.
Innovation Solution
A vehicle lamp design featuring a light source unit with semiconductor light emitting devices arranged in triangular arrays along rows on a wiring board, allowing for more devices to be placed on the edge regions and optimizing the length-to-width ratio for uniform light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If packaged LEDs are used in vehicle lamps, then the lighting function is achieved, but the mass production yield rate is low and fabrication costs are high
Solution Approach 1:
The invention extracts the LED chip from its traditional package structure and mounts it directly onto a circuit board in an array formation. This eliminates the need for individual packaging of each LED, thereby increasing mass production yield rate and reducing fabrication costs while maintaining the lighting function.
2Illumination intensity
If traditional LED arrangements are used, then the manufacturing process is simple, but the brightness uniformity across different regions is poor
Solution Approach 1:
The invention implements local quality by arranging LED chips in a triangular array pattern with different spacing configurations. The edge regions have different spacing compared to central regions, allowing optimized light distribution across different areas of the lamp to achieve overall brightness uniformity.
Solution Approach 2:
The triangular array arrangement introduces asymmetric spacing between LED chips in different regions. This asymmetric configuration compensates for the natural light fall-off and ensures uniform illumination across the entire lamp surface, including edge regions.
3Illumination intensity
If fewer semiconductor light emitting devices are placed on edge regions, then the device complexity is low, but the brightness of edge regions is insufficient
Solution Approach 1:
The invention transitions from a simple linear or grid arrangement to a two-dimensional triangular array configuration. This dimensional change allows for optimized placement of LED chips in both central and edge regions, ensuring sufficient brightness coverage across the entire lamp surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement enhances the brightness of edge regions and ensures uniform light emission across various shapes, overcoming the limitations of packaged LEDs by increasing the number of light emitting devices on edges and reducing brightness deviations between edge and central portions.
Implementation Method 1
light emitting diodes (LEDs) are in the spotlight as light sources for vehicle lamps
Implementation Method 2
the LED itself other than the package is under development as a semiconductor light emitting device of converting a current into light
Data Source
AI summary
The present invention relates to a vehicle lamp, and more particularly, a vehicle lamp using a semiconductor light emitting device. The vehicle lamp according to the present invention includes a light source unit, and the light source unit includes a wiring board, and a plurality of semiconductor light emitting devices electrically connected to the wiring board and arranged along a plurality of rows, wherein the plurality of semiconductor light emitting devices include first semiconductor light emitting devices arranged at preset intervals along a first row of the plurality of rows, and second semiconductor light emitting devices arranged at the preset intervals along a second row neighboring to the first row, and wherein each of the second semiconductor light emitting devices is disposed between neighboring first semiconductor light emitting devices of the first semiconductor light emitting devices so as to form triangular arrays with the first semiconductor light emitting devices.