Vehicle Light Source Module Heat Dissipation
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Solution Overview
Problem
Vehicle headlamps using high-luminance LEDs face thermal deformation issues due to excessive heat generation, reducing durability, and existing light source modules lack efficient heat dissipation and easy assembly solutions.
Innovation Solution
A light source module incorporating a double heat dissipation structure with a heat pipe and heat sink, diagonally arranged light-emitting devices, and a snap ring coupling mechanism for easy assembly and separation, enhancing thermal contact and reducing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high-luminance LEDs are used as light sources, then luminance and lifespan are improved, but heat generation increases causing thermal deformation and reduced durability
Solution Approach 1:
The patent converts the harmful heat generated by high-luminance LEDs into a manageable thermal flow by implementing a heat pipe structure that guides and dissipates the heat away from the LED components, transforming the harmful thermal energy into a controlled heat dissipation process that maintains LED durability while preserving high luminance output
Solution Approach 2:
The patent introduces a heat pipe as an intermediary thermal management component between the LED light sources and the external environment, mediating the heat transfer process to prevent direct thermal contact with surrounding parts and thereby maintaining both high luminance performance and component durability
2Temperature
If complex heat dissipation structures are implemented, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat pipe structure serves multiple functions simultaneously: it acts as a thermal conduction path, a structural support element, and a heat distribution mechanism, thereby achieving efficient heat dissipation without proportionally increasing device complexity
Solution Approach 2:
The patent merges the heat dissipation function with the existing structural components of the headlamp assembly, integrating the heat pipe into the housing and mounting structures rather than adding separate dedicated heat dissipation components, thus improving temperature management while minimizing complexity increase
3Manufacturing precision
If traditional assembly methods are used, then manufacturing precision is maintained, but ease of assembly and repair is reduced
Solution Approach 1:
The patent segments the headlamp assembly into modular components (LED modules, heat pipe units, housing sections) that can be independently manufactured and assembled, allowing for precise manufacturing of each component while significantly improving ease of assembly and repair through simplified modular integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances heat dissipation, increases the durability of headlamps by managing thermal stress, and facilitates easy assembly and disassembly of the light source module.
Implementation Method 1
a heat pipe having a plate shape, a pair of substrates provided on both sides of the heat pipe, respectively, light-emitting devices provided on the substrates, respectively
Implementation Method 2
capable of increasing heat dissipation efficiency through a double heat dissipation structure of a heat pipe and a heat sink
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
The present invention provides a light source module for a vehicle comprising: a plate-like heat sink; substrates provided on both sides of the heat sink, respectively; light emitting devices provided on the substrates, respectively; a hole for transmitting light emitted from the light emitting devices; and a pair of bases coupled to the outside of the substrates, wherein the light emitting device includes a first light emitting device and a second light emitting device which are arranged diagonally, and a blocking member is disposed at a lower end of the second light emitting device. As such, it is possible to increase the heat dissipation efficiency by increasing the contact between the heat sink and the substrates.