Vehicle Light Source Unit Thermal Isolation via Segmented Heat Dissipation Plates

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Solution Overview

Problem

Existing vehicle light source units with semiconductor light emitting elements, such as LEDs, face inefficiencies in heat dissipation due to the transfer of heat between the semiconductor light emitting element package and the lighting control circuit through a metal supporting member, leading to insufficient heat dissipation.

Innovation Solution

A light source unit design featuring a semiconductor light emitting element, a lighting circuit, a first heat dissipation plate, a second heat dissipation plate, a wiring member, and an interconnection member, where the interconnection member is made of a material with lower thermal conductivity than the heat dissipation plates, allowing for improved heat dissipation by reducing heat transfer between the plates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal supporting member is used to mount both the semiconductor light emitting element package and the lighting control circuit, then structural support and electrical connection are provided, but heat dissipation efficiency deteriorates due to heat transfer between the two components

Engineering Contradiction:

Improvestructural supportVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The supporting member is divided into two distinct parts: a first supporting portion for mounting the semiconductor light emitting element package and a second supporting portion for mounting the lighting control circuit. This segmentation prevents heat transfer between the two components while maintaining structural support functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A heat insulating member is introduced as an intermediary between the first and second supporting portions. This heat insulating member electrically connects the two portions while thermally isolating them, allowing structural support and electrical connection without heat transfer.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If the semiconductor light emitting element package and lighting control circuit are mounted on the same metal supporting member, then device complexity is reduced, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvestructural integrationVSAvoidheat dissipation efficiency

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The supporting member is segmented into functionally distinct first and second supporting portions with different thermal characteristics. The first portion has high thermal conductivity for heat dissipation from the LED package, while the second portion has low thermal conductivity to isolate the lighting control circuit from heat.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the supporting structure are assigned different thermal properties. The first supporting portion is designed with high thermal conductivity material for efficient heat dissipation, while the second supporting portion uses low thermal conductivity material for thermal isolation, optimizing each region for its specific function.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat dissipation efficiency for both the semiconductor light emitting element and the lighting circuit, preventing heat buildup and facilitating better thermal management, while also allowing for easier assembly and compact design.

Implementation Method 1

a first heat dissipation plate on which the semiconductor light emitting element is placed; a second heat dissipation plate on which the lighting circuit is placed

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an interconnection member to which the first heat dissipation plate and the second heat dissipation plate are attached. The interconnection member is lower in thermal conductivity than the first heat dissipation plate and the second heat dissipation plate

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10041645B2Light source unit, lighting device, and vehicle

Publication Date: 2018.08.07 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

The light source unit includes: a semiconductor light emitting element; a lighting circuit configured to operate the semiconductor light emitting element; a first heat dissipation plate on which the semiconductor light emitting element is placed; a second heat dissipation plate on which the lighting circuit is placed; a wiring member electrically interconnecting the semiconductor light emitting element and the lighting circuit; and an interconnection member to which the first heat dissipation plate and the second heat dissipation plate are attached. The interconnection member is lower in thermal conductivity than the first heat dissipation plate and the second heat dissipation plate.