Vehicle Memory Module Sensor Enclosure for Vibration and Thermal Reliability

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Solution Overview

Problem

Memory devices used in vehicles and other mobile electronic devices face mechanical reliability issues due to external impacts and high temperature environments, leading to malfunctions and reduced dynamic thermal throttling entry times, which hinder normal operation.

Innovation Solution

A storage device design featuring a memory module with a memory controller, sensors for temperature, vibration, and pressure monitoring, which adjusts operations based on detected environmental conditions to ensure safe and stable performance, including dynamic thermal throttling and power management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the memory device is used in mobile electronic devices such as vehicles, then the memory device can be applied to mobility applications, but the mechanical reliability deteriorates due to external impacts and vibrations

Engineering Contradiction:
Improveapplication to mobility devicesVSAvoidmechanical reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies beforehand cushioning by providing a buffer between the memory device and the external environment. The enclosure structure with shock-absorbing materials and the vibration isolation mechanisms are designed in advance to protect the memory device from impacts and vibrations that may occur during mobile device operation, thereby maintaining mechanical reliability while enabling mobility applications

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Adaptability or versatility

If the memory device operates in high temperature environments, then the device can function in various conditions, but the dynamic thermal throttling entry time shortens causing malfunction

Engineering Contradiction:
Improveoperation in various environmentsVSAvoidoperational stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent implements feedback mechanisms through temperature sensors that continuously monitor the thermal environment and provide real-time data to the control system. This feedback enables the memory device to detect temperature changes and adjust its operation accordingly, preventing malfunctions in high temperature environments while maintaining the ability to operate in various conditions

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent applies preliminary action by implementing preventive thermal management measures before temperature-induced malfunctions occur. The system proactively monitors temperature conditions and initiates thermal throttling or cooling protocols in advance, preventing the shortening of dynamic thermal throttling entry time and ensuring operational stability in high temperature environments

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances operational safety and reliability by detecting and responding to external and internal environmental factors, preventing malfunctions and maintaining stable operation in adverse conditions.

Implementation Method 1

A first sensor is disposed on the first enclosure and configured to detect a state and provide a signal for the state to the memory controller

Methodology Applied
Scientific EffectSensor detection:

Data Source

PatentUS12131054B2Storage device
Publication Date: 2024.10.29 SAMSUNG ELECTRONICS CO LTD
  • US12131054B2 patent drawing
  • US12131054B2 patent drawing
  • US12131054B2 patent drawing

AI summary

A storage device includes a memory module including a memory device, a module board including a memory controller configured to control the memory device, and a memory connector disposed on one side of the module board. The storage device also includes a first enclosure disposed on a first surface of the memory module, a second enclosure disposed on a second surface opposite to the first surface of the memory module, and a first sensor disposed on the first enclosure and configured to detect a state and provide a signal for the state to the memory controller. The first enclosure includes a first long side extending in a first direction and a first short side extending in a second direction perpendicular to the first direction. A ratio of the first long side to the first short side ranges from 1.2 to 3.5.