Vehicle-Mountable Device Thermal Management via Intermediary Board
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Solution Overview
Problem
Existing vehicle-mountable devices face challenges in heat dissipation, particularly with heat pipes being directly exposed to the external environment, leading to damage and poor machinability due to paint baking processes, and requiring redesigns when upgrading electronic components.
Innovation Solution
Incorporating a first temperature equalization board and heat pipes within the device, where the heat pipes are not directly exposed to the external environment, and using thermally conductive members to enhance heat transfer and reduce component count, facilitating easier assembly and upgrading by isolating the heat pipes from paint baking and corrosive environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat pipe is disposed on the outer wall of the housing to dissipate heat, then the heat dissipation function is achieved, but the heat pipe is easily damaged due to direct contact with the external environment
Solution Approach 1:
The patent introduces a temperature equalization board as an intermediary component between the heat pipe and the external environment. The heat pipe is disposed on the temperature equalization board rather than directly on the housing outer wall. This intermediary board protects the heat pipe from environmental damage while still enabling heat dissipation functionality.
Solution Approach 2:
The patent segments the heat dissipation system into distinct functional modules: the heat pipe, the temperature equalization board, and the housing. By separating the heat pipe from direct exposure to the external environment through this segmentation, the reliability of the heat pipe is improved while maintaining the overall heat dissipation function.
2Ease of manufacture
If the heat pipe is disposed on the housing for heat dissipation, then heat can be dissipated to the external environment, but the paint baking process causes damage and poor machinability
Solution Approach 1:
The temperature equalization board serves as a protective intermediary layer between the heat pipe and the housing paint baking process. This intermediary structure prevents direct thermal and chemical damage to the heat pipe during manufacturing, improving both machinability and heat pipe integrity.
Solution Approach 2:
The patent applies beforehand cushioning by positioning the temperature equalization board between the heat pipe and the housing before the paint baking process. This pre-positioned intermediary structure cushions the heat pipe against harmful effects during manufacturing, preventing damage before it occurs.
3Adaptability or versatility
If the heat pipe is disposed on the housing, then heat dissipation is achieved, but redesign is required when upgrading electronic components
Solution Approach 1:
The patent segments the device into independent modules: the temperature equalization board with heat pipes, the PCB with electronic components, and the housing. This modular segmentation allows the electronic components on the PCB to be upgraded independently without requiring redesign of the heat dissipation system, improving adaptability while managing device complexity.
Solution Approach 2:
The temperature equalization board serves multiple functions: it protects heat pipes from environmental damage, provides a mounting surface for heat pipes, and acts as a thermal management interface. This multi-functionality reduces the need for separate components and simplifies the overall device structure, making upgrades easier.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves heat dissipation efficiency by evenly dispersing heat within the device, reduces the risk of heat pipe damage, and simplifies the upgrading process by allowing for independent replacement of temperature equalization boards without redesigning the entire device.
Implementation Method 1
The first protrusion is in contact with the first heat emission component or is in contact with the first heat emission component by using a thermally conductive member, to conduct heat generated by the first heat emission component to the first temperature equalization board
Implementation Method 2
the first heat pipe disperses the heat conducted to the housing, so that the heat is dispersed on the housing as evenly as possible
Data Source
AI summary
This application discloses a vehicle-mountable device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.