Vehicle PCB Connection Structure Using Shared Antenna Feed
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Solution Overview
Problem
Existing vehicle communication devices face challenges in reducing size and weight due to the need for multiple antenna connectors on sub substrates, leading to increased overall size and limited thinning benefits, and varying communication specifications across countries complicate production and increase costs.
Innovation Solution
A substrate connection structure where a main substrate with a network access device and RF connectors is connected to a sub substrate with optional communication functions via a coaxial connector in a vertically overlapping manner, eliminating the need for additional antenna connectors on the sub substrate and allowing for compact configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antenna connectors are provided on the sub substrate to support various communication functions, then the communication versatility is improved, but the overall device size and thickness increase
Solution Approach 1:
The patent merges multiple antenna connectors and communication functions onto a single main substrate. The main substrate integrates connectors for cellular, Wi-Fi, Bluetooth, and other communication functions, eliminating the need for separate sub substrates with multiple connectors. This consolidation reduces the overall device thickness while maintaining full communication versatility.
Solution Approach 2:
The main substrate is designed as a universal platform that supports multiple communication functions through integrated connectors and circuitry. By making the main substrate multi-functional rather than requiring separate specialized sub substrates, the design achieves versatility without increasing thickness.
2Area of stationary object
If multiple sub substrates with different communication functions are stacked to reduce size, then the footprint area is reduced, but the manufacturing complexity and cost increase due to varying specifications
Solution Approach 1:
The patent segments communication functions into modular units that can be selectively activated or deactivated based on regional requirements. The main substrate contains all necessary connectors and circuitry, but only the required functions are enabled through software or hardware switches, simplifying production for different markets.
Solution Approach 2:
The system incorporates dynamic configuration capabilities where communication functions can be selectively enabled or disabled based on the target market's requirements. This dynamic approach allows a single base design to serve multiple regions without requiring separate manufacturing lines for each specification variant.
3Length of stationary object
If the sub substrate is made thinner to achieve overall device thinning, then the device thickness is reduced, but the structural strength and connection reliability deteriorate
Solution Approach 1:
The patent transitions from vertical stacking of multiple thick sub substrates to a horizontal integration approach on a single main substrate. By redistributing connectors and circuitry across the surface area of the main substrate rather than stacking layers vertically, the design achieves thinning without compromising structural integrity or connection reliability.
Data Source
AI summary
A substrate connection structure for a vehicle-mounted communication device includes a network access device having at least a wireless communication function a main substrate on which the network access device is mounted, an antenna be used for the wireless communication performed by the network access device, and an RF connector, which is mounted on the main substrate, connected to the antenna. The main substrate is connected to a sub substrate having an optional communication function via a coaxial connector in a vertically overlapping manner. The antenna is used for the optional communication function performed by the sub substrate. The antenna is connected to the optional communication function via the coaxial connector when the main substrate is connected to the sub substrate.