Vehicle Window Optoelectronic Layering to Prevent Glass Breakage
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Solution Overview
Problem
Existing methods for integrating LED lighting into vehicle windows face challenges such as glass breakage due to thickness issues with electronic components and the need for thin components to compensate for the thickness of laminated glass, which limits the use of thicker electronics and complicates the manufacturing process.
Innovation Solution
A window design featuring a transparent carrier layer, a dielectric layer, and structured conductors with optoelectronic components like LEDs, where conductive vias provide electrical connections and a transparent covering layer protects the components, allowing for thicker electronics without generating stress in the glass.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LEDs are laminated inside vehicle glazings with a thermoplastic intermediate layer, then interior illumination and information display are provided, but the electronic components must be kept as thin as possible to avoid glass breakage when the intermediate layer cannot compensate for their thickness
Solution Approach 1:
The patent transitions from a 2D planar arrangement of LEDs on the glass surface to a 3D embedded structure within the laminated glass layers. The LEDs are positioned in the intermediate layer between glass panes, utilizing the third dimension (depth) to distribute stress and avoid surface-level thickness constraints that would compromise glass strength.
Solution Approach 2:
The patent implements a nested structure where electronic components (LEDs, circuit boards) are embedded within the laminated glass assembly. The LEDs are housed in cavities or recesses within the intermediate layer, which is itself sandwiched between glass panes, creating a nested configuration that protects components while maintaining glass integrity.
2Reliability
If thicker electronic components are used in laminated glass, then component functionality and durability are improved, but glass breakage occurs when the intermediate layer is incapable of compensating the thickness
Solution Approach 1:
The patent employs the intermediate layer as a cushioning element that is specifically designed to accommodate the thickness of electronic components. This layer acts as a stress-absorbing buffer that prevents the transmission of mechanical stresses to the glass panes, thereby protecting against glass breakage while allowing the use of thicker, more durable electronic components.
Solution Approach 2:
The patent changes the physical and mechanical parameters of the intermediate layer to optimize its thickness and material properties. By adjusting the intermediate layer's thickness and selecting materials with appropriate elastic modulus and compressibility, the system can absorb the volume of thicker electronic components without generating harmful stresses in the glass.
3Ease of manufacture
If electronic components are arranged adjacent the thermoplastic intermediate layer, then the intermediate layer compensates for thickness, but it becomes necessary to use electronic components that are as thin as possible
Solution Approach 1:
The patent segments the electronic assembly into modular components (LED modules, circuit boards, connectors) that can be independently manufactured and then assembled within the laminated glass structure. This segmentation allows each component to be optimized for its specific function without being constrained by overall thickness requirements, as the modular units can be stacked or arranged vertically within the intermediate layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the manufacture of vehicle windows with integrated optoelectronic components that are both easy and inexpensive to produce, while avoiding glass breakage and allowing for the use of thicker electronics, thus enhancing the durability and functionality of the window.
Implementation Method 1
at least one conductive via is arranged through the dielectric layer to electrically connect the at least one first structured conductor with the at least one optoelectronic component
Implementation Method 2
at least one optoelectronic component, in particular a LED
Implementation Method 3
at least one optoelectronic component, in particular a LED
Data Source
AI summary
It is provided a window of a vehicle, optoelectronic circuits, in particular optoelectronic circuits for a window of a vehicle and a method for manufacturing a window of a vehicle including at least one optoelectronic component. It is further provided a display comprising at least one display module each comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED. In addition, a method for manufacturing a display module comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED, is provided.