Vented Midplane for Network Switch Signal Integrity and Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional midplanes in network switches face challenges in providing sufficient airflow for thermal cooling while maintaining signal integrity, and they often require a solid printed circuit board and connectors that limit flexibility and increase the chassis height.
Innovation Solution
A midplane with voids that allow for orthogonal direct connections between components, eliminating the need for a solid printed circuit board and reducing the use of air plenums, while providing power, control connectivity, and mechanical alignment through structural members and alignment pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solid printed circuit board midplane is used to maintain signal integrity, then signal integrity is improved, but airflow for thermal cooling is restricted and chassis height increases
Solution Approach 1:
The midplane is segmented into a frame structure with multiple voids rather than a solid board. The frame contains structural members that provide mechanical support and electrical connections while creating open spaces for airflow. This segmentation allows simultaneous achievement of signal integrity through controlled connection points and thermal cooling through unrestricted air flow paths.
Solution Approach 2:
The midplane employs a porous-like open frame structure with multiple voids distributed throughout. These voids function similarly to porous materials by allowing fluid (air) to pass through while maintaining structural integrity. The frame members provide the necessary mechanical and electrical functions while the voids enable thermal management through enhanced airflow.
2Adaptability or versatility
If orthogonal midplane connectors are used to allow greater design flexibility, then adaptability is improved, but device complexity increases due to additional connectors and assembly requirements
Solution Approach 1:
The connector functionality is extracted from the midplane structure itself. Instead of integrating connectors into the midplane, the design uses a frame with voids that allow direct orthogonal connections between components. This extraction simplifies the midplane to its essential structural and electrical distribution functions while allowing flexible component interconnections through the voids.
Solution Approach 2:
The frame structure serves multiple functions simultaneously: it provides mechanical support, establishes electrical connections through bus bars and traces, defines component mounting positions, and enables airflow. This multi-functionality reduces the need for separate specialized components and simplifies the overall device architecture.
3Strength
If a solid midplane structure is used to provide mechanical support, then strength is improved, but component density decreases and airflow is restricted
Solution Approach 1:
The solid midplane is segmented into a frame structure where structural members are strategically positioned to provide necessary mechanical support only where required. This segmentation removes unnecessary material while maintaining strength at critical locations, thereby increasing component density and enabling airflow through the created voids.
Solution Approach 2:
The frame structure applies local quality by concentrating structural members at specific locations where mechanical support is needed for component mounting and electrical connections. The regions between structural members are left as open voids, creating a non-uniform structure that optimizes both mechanical strength and airflow characteristics.
Data Source
AI summary
A novel midplane is shaped with voids through which a dataplane connection is made between components on one side of the midplane and components on the opposite side of the midplane. The voids in the novel midplane offer numerous advantages in the design of network devices, including improved cooling performance, minimizing rack unit space and maximizing interface density, improved signal integrity allowing greater bandwidth through elimination of midplane signaling connections, improved upgradability of orthogonal direct connectors with little or no impact on the midplane or chassis, and proper alignment between the components of the dataplane.