Vented Push Switch Resin Case Groove Design

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Solution Overview

Problem

Conventional push switches experience deformation or breakage due to heat expansion during reflow soldering, which can damage the protection sheets and resin cases, and also face issues with flux ingress affecting contact reliability.

Innovation Solution

The push switch design incorporates a resin case with a recess, through hole, and groove, where the groove extends to the outside, allowing air expansion and flux prevention, with heat-resistant materials and secure coupling of protection sheets to prevent deformation and ensure waterproofing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the push switch is sealed with protection sheets during reflow soldering, then waterproofing performance is improved, but heat expansion causes deformation or breakage of the protection sheets and resin case

Engineering Contradiction:
Improvewaterproofing performanceVSAvoidresin case and protection sheet integrity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The groove on the lower surface of the resin case divides the sealed cavity into multiple regions, allowing differential expansion of air pockets during reflow soldering. This segmentation prevents uniform pressure buildup that would otherwise deform or break the protection sheets and resin case, while maintaining overall waterproofing integrity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses deformation and breakage of the push switch components during reflow soldering, maintains contact reliability by preventing flux ingress, and enhances waterproofing performance, suitable for thinner, high-performance electronic devices.

Implementation Method 1

heat from reflow soldering the push switch may expand the air inside the resin case

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10418203B2Vented push switch
Publication Date: 2019.09.17 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US10418203B2 patent drawing
  • US10418203B2 patent drawing
  • US10418203B2 patent drawing

AI summary

A push switch of the present disclosure has: a resin case that has a recess, a through hole, and a groove; a connection terminal; an upper protection sheet; and a lower protection sheet. The through hole penetrates from a bottom part of the recess to a lower surface of the resin case, and the groove is provided on the lower surface of the resin case. The through hole and the groove are connected to each other, and the through hole overlaps with the lower protection sheet in plan view. The groove has a first area and a second area, and of the first area and the second area, only the first area overlaps with the lower protection sheet in plan view.