Ventilated Fin Layout for Natural Convection Cooling in Electronics

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Solution Overview

Problem

Existing electronic devices, such as power converters on railway vehicles, experience insufficient cooling performance when stationary, as they rely on natural convection which is inadequate for effective heat dissipation.

Innovation Solution

An electronic device design featuring a heat-receiving block, heat transfer members, and fins with strategically placed ventilation holes, where the ratio of opening area in the middle region is higher than in the surrounding regions, facilitating airflow and enhancing natural convection cooling even when the vehicle is stopped.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If natural convection cooling is used for electronic components, then the device can operate when the vehicle is stopped, but the cooling performance is insufficient

Engineering Contradiction:
Improvecooling performanceVSAvoidheat dissipation efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The fin structure is designed with non-uniform ventilation hole distribution, where the middle region has a higher ratio of opening area compared to the first and second regions. This local quality variation optimizes airflow patterns to enhance natural convection cooling effectiveness in the middle region where heat generation is highest, thereby improving overall cooling performance without requiring additional energy input.

Inventive Principle:
Principle #3Local quality

2Reliability

If fins are added to increase heat dissipation surface area, then cooling performance improves, but device complexity increases

Engineering Contradiction:
Improvecooling performanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The fin structure is divided into three distinct regions along the travel direction: a first region, a middle region, and a second region. Each region has a different ventilation hole area ratio, with the middle region having the highest ratio. This segmentation allows optimized cooling in different zones without requiring multiple separate components, thereby improving cooling performance while maintaining relatively simple overall structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The fin structure serves multiple functions simultaneously: it provides heat dissipation surface area, guides airflow patterns through strategically placed ventilation holes, and creates natural convection currents. The integrated design combines these functions into a single component rather than requiring separate elements, reducing device complexity while improving cooling performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively cools electronic components through natural convection by optimizing airflow patterns, ensuring efficient heat dissipation both during travel and when the vehicle is stationary.

Implementation Method 1

The heat transfer member extends away from the second main surface to transfer, in a direction away from the second main surface, heat transferred from the electronic component through the heat-receiving block

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

The one or more fins are attached to the heat transfer member to dissipate heat transferred from the electronic component through the heat-receiving block and the heat transfer member into ambient air

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

At least one fin of the one or more fins has at least one ventilation hole to guide the ambient air in the direction away from the second main surface

Methodology Applied
Scientific EffectNatural convection: Free Convection

Data Source

PatentUS20250008705A1Electronic device
Publication Date: 2025.01.02 MITSUBISHI ELECTRIC CORP
  • US20250008705A1 patent drawing
  • US20250008705A1 patent drawing
  • US20250008705A1 patent drawing

AI summary

An electronic device includes a heat-receiving block, a heat transfer member, and one or more fins. At least one fin of the one or more fins has at least one ventilation hole to guide air in a direction away from a second main surface of the heat-receiving block. The at least one fin of the one or more fins having the at least one ventilation hole has a first region including a middle of the at least one fin having the at least one ventilation hole in a travel direction or a width direction of a vehicle and second regions located across the first region and having a same area as the first region. A ratio of an opening area of the at least one ventilation hole is higher in the first region than in the second regions.