Ventilated Wafer Puck With Labyrinth Channel for Gas Exchange

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Solution Overview

Problem

Existing semiconductor wafer pucks suffer from poor gas exchange due to their sealed design, leading to deformation and contamination of the wafer surface during vacuuming and inflation processes, which affects the integrity of the wafers.

Innovation Solution

A ventilated puck design with a ventilation channel that includes a dustproof labyrinth structure, allowing for improved gas exchange while preventing dust entry, is introduced. This design features various groove configurations such as L-shaped, zigzag, and annular grooves with protrusions to manage gas flow and dust prevention.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the puck is designed with a tight fit between upper box and lower box to achieve sealing, then the sealing performance is improved, but gas exchange between interior and exterior deteriorates

Engineering Contradiction:
Improvesealing performanceVSAvoidgas exchange efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The ventilation channel is segmented into multiple sections including inlet, labyrinth structure, and outlet portions, allowing gas to flow through while preventing dust entry. The channel divides the sealed structure into functional zones that simultaneously achieve sealing and ventilation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The ventilation channel acts as an intermediary structure between the sealed interior and exterior environment. It mediates gas exchange while filtering out dust particles through its labyrinthine design, allowing beneficial gas flow while blocking harmful contaminants.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If the ventilation channel allows gas flow to improve gas exchange, then gas exchange efficiency is improved, but dustproof performance deteriorates

Engineering Contradiction:
Improvegas exchange efficiencyVSAvoiddust contamination
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The ventilation channel employs curved and zigzag pathways instead of straight lines, creating a labyrinth structure that forces gas to follow a tortuous path. This curved geometry increases flow resistance for dust particles while allowing gas molecules to pass through more easily.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The ventilation channel structure creates a porous-like pathway system with multiple openings and passages. The labyrinthine configuration provides numerous flow paths for gas while the complex geometry acts as a physical barrier that traps and removes dust particles from the gas stream.

Inventive Principle:
Principle #31Porous materials

3Reliability

If the puck is compressed during inflation to achieve tight sealing, then sealing performance is improved, but the spider plate is pressed onto the wafer surface causing imprints

Engineering Contradiction:
Improvesealing performanceVSAvoidwafer surface quality
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The ventilation channel provides dynamic pressure relief during inflation and vacuum processes. By allowing continuous gas exchange, the channel prevents excessive pressure buildup that would otherwise compress the puck and spider plate onto the wafer, maintaining stable internal pressure that protects wafer surface quality.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The harmful compression force is extracted or relieved through the ventilation channel. The channel enables excess gas to escape during inflation, preventing over-pressurization that would cause the puck to compress and damage the wafer surface, while maintaining sufficient sealing for protection.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ventilated puck enhances gas exchange between the interior and exterior, preventing puck deformation-induced contamination and ensuring the cleanliness of the semiconductor wafers by allowing smooth gas flow while keeping dust out.

Implementation Method 1

the constantly changing inner diameter dimension causes a constant change of the flow rate of the gas, so that the dust settles at a section which has larger inner diameter and slower flow rate

Methodology Applied
Scientific EffectFlow rate change due to varying cross-section: Venturi Effect

Implementation Method 2

the constantly changing inner diameter dimension causes a constant change of the flow rate of the gas, so that the dust settles at a section which has larger inner diameter and slower flow rate, thereby achieving the dustproof purpose

Methodology Applied
Scientific EffectSedimentation: Sedimentation

Data Source

PatentUS12040206B2Ventilated puck
Publication Date: 2024.07.16 BEIJING TONGMEI XTAL TECH CO LTD
  • US12040206B2 patent drawing
  • US12040206B2 patent drawing
  • US12040206B2 patent drawing

AI summary

A ventilated puck is provided. The ventilated puck includes an upper box, a spider plate, and a lower box. In particular, the upper box is fitted on the lower box to form a hollow structure, in which the spider plate is disposed. A ventilation channel for communicating the hollow structure with an external environment is provided in the upper box, or in the lower box or at interface between the upper box and the lower box. The ventilated puck of the present application may ensure gas exchange during the gas protection process conducted on semiconductor wafers, thereby preventing deformation of the puck due to pressure differences. Optionally, the interior of the ventilation channel is provided with a dustproof labyrinth structure, thereby preventing the entry of dust.