Ventilation Holes in Waterproof Electronic Device Layers

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Solution Overview

Problem

Conventional notebook computers face a trade-off between waterproof performance and heat dissipation due to the limitations of existing waterproof layers that prevent liquid ingress but restrict heat dissipation, leading to potential overheating and system failure.

Innovation Solution

An electronic device design featuring a main body with an opening covered by a carrying layer and a waterproof layer, where the carrying layer and waterproof layer have ventilation holes connected to form a ventilation channel, and a supporting element with additional ventilation holes to facilitate heat expulsion while maintaining waterproof integrity by positioning these holes to prevent liquid ingress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a waterproof layer is disposed under the carrying layer to prevent liquid ingress, then waterproof performance is improved, but heat dissipation performance deteriorates

Engineering Contradiction:

Improvewaterproof performanceVSAvoidheat dissipation performance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent divides the waterproof layer into multiple segments: a first waterproof layer with first ventilation holes and a second waterproof layer with second ventilation holes. This segmentation allows each layer to contribute to both waterproofing and heat dissipation functions simultaneously, resolving the contradiction between maintaining waterproof integrity and enabling thermal ventilation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the waterproof structure are assigned different properties. The first waterproof layer has first ventilation holes for heat dissipation while maintaining waterproofing, and the second waterproof layer has second ventilation holes positioned to allow heat escape. This local differentiation enables simultaneous achievement of waterproof performance and heat dissipation performance in different areas of the same structure.

Inventive Principle:

Principle #3Local quality

2Temperature

If an opening is formed on the waterproof layer to improve heat dissipation, then heat dissipation performance is improved, but waterproof performance deteriorates

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidwaterproof performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent employs waterproof layers with ventilation holes that function as porous structures. These holes are designed to allow air and heat to pass through while the waterproof material properties prevent liquid penetration. This porous approach enables the opening function for heat dissipation without compromising the waterproof barrier, directly resolving the contradiction between opening for ventilation and maintaining waterproof seal.

Inventive Principle:

Principle #31Porous materials

3Temperature

If the opening is enlarged to improve heat dissipation performance, then heat dissipation performance is improved, but waterproof performance is affected

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidwaterproof performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

Instead of creating one large opening, the patent segments the ventilation function into multiple smaller openings distributed across two different waterproof layers. The first waterproof layer contains first ventilation holes and the second waterproof layer contains second ventilation holes. This segmentation allows sufficient total opening area for heat dissipation while each individual opening remains small enough to maintain waterproof integrity.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively dissipates heat while maintaining waterproof performance by ensuring that hot air can be expelled through connected ventilation holes without compromising the waterproof seal, preventing liquid entry and ensuring the electronic device operates effectively.

Implementation Method 1

The first ventilation hole is exposed by the second ventilation hole and connected with the inner space... the ventilation hole is connected with the first ventilation hole

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

The supporting element is disposed on the carrying layer and covers the first ventilation hole. The supporting element has at least one third ventilation hole, wherein the third ventilation hole is connected with the first ventilation hole

Methodology Applied

Scientific EffectBuoyancy: Archimedes' Principle (Buoyancy)

Data Source

PatentUS8178803B2Electronic device having key

Publication Date: 2012.05.15 ACER INC

AI summary

An electronic device including a main body, a carrying layer disposed at the main body, a waterproof layer stacked on the carrying layer and located between the carrying layer and the main body, a supporting element disposed on the carrying layer, a key disposed on the supporting element, and a guiding element connected to the key is provided. The main body has an inner space and an opening exposing the inner space. The carrying layer covering the opening has a first ventilation hole and an assembly hole. The waterproof layer has a second ventilation hole. The first ventilation hole is exposed by the second ventilation hole and connected with the inner space. The assembly hole is covered by the waterproof layer. The supporting element covers the first ventilation hole and has a third ventilation hole connected with the first ventilation hole. The guiding element is locked at the assembly hole.