Venturi Fin Heat Sink for Fanless Heat Dissipation
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Solution Overview
Problem
Existing heat transfer devices for power electronic modules and similar systems are complex, costly, and inefficient due to their geometric complexity and reliance on fans for heat dissipation.
Innovation Solution
A heat transfer device featuring a thermally conductive plate with a fin structure that includes a conduit connected to a Venturi-effect neck, allowing for efficient entry of cold air and discharge of hot air, thereby enhancing heat transfer without the need for fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heat transfer devices use fans and complex geometric structures to enhance heat dissipation, then heat transfer efficiency is improved, but device complexity and cost increase
Solution Approach 1:
The patent employs natural convection currents to drive air flow through the heat transfer device without requiring external fans or mechanical propulsion systems. The heated air naturally rises through the vertical channels, creating a self-sustaining circulation pattern that simplifies the device structure while maintaining effective heat dissipation
Solution Approach 2:
The heat transfer device is divided into multiple vertical channels or fins that are arranged in a segmented pattern. This segmentation increases the surface area for heat exchange while maintaining a simple overall structure, allowing efficient heat transfer without complex geometric configurations
2Productivity
If conventional heat transfer devices use fans and complex structures to enhance heat dissipation, then heat transfer efficiency is improved, but manufacturing cost increases
Solution Approach 1:
By eliminating the need for fans and complex mechanical components, the device reduces manufacturing costs associated with precision machining, assembly, and maintenance of moving parts. The simple vertical channel structure can be manufactured using conventional fabrication techniques
Solution Approach 2:
The patent employs simple, easily manufacturable materials and structures that can be produced at low cost. The vertical channels and fins are designed to be straightforward geometric forms that require minimal processing and can be manufactured using cost-effective methods
3Productivity
If conventional heat transfer devices use fans and complex structures to enhance heat dissipation, then heat transfer efficiency is improved, but device volume increases
Solution Approach 1:
The patent transitions from horizontal or radial heat transfer configurations to a vertical arrangement of channels. This dimensional change allows the heat transfer surface to extend in the vertical direction, achieving high heat dissipation efficiency within a compact footprint that reduces overall device volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively increases heat transfer efficiency while reducing costs and space requirements by leveraging natural convection and the Venturi effect, allowing for quick and efficient heat dissipation.
Implementation Method 1
said conduit being connected to at least one Venturi-effect neck for supplying cooling air into the conduit
Implementation Method 2
at least one fin placed on a second side of said plate opposite to the first side and including a conduit extending in a longitudinal direction
Data Source
AI summary
The invention relates to a device (2) for transferring heat from a thermally conductive plate (30) capable of capturing the heat from a zone placed on a first side (32) of the plate, the device comprising at least one fin (35) placed on a second side (34) of the plate (30) opposite the first side (32) and having a duct (36) extending in a longitudinal direction (L) between a first end (38) connected to the plate and a second end (40) opposite the first end and which opens out, the duct (36) being connected to at least one Venturi-effect neck (42) bringing cooling air into the duct, the neck (42) being formed in the vicinity of the first end of the duct and the plate (30).