Selective Vapor Deposition via Venturi Nozzle and Robotic Arm
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Solution Overview
Problem
Existing vapor deposition processes face limitations such as line-of-sight transfer constraints and unwanted deposition on internal chamber surfaces, lacking selective control over deposition areas and efficiency.
Innovation Solution
A selective vapor deposition method utilizing cathodic arc evaporation, multi-axis robotic arm, and electro-magnetic repulsion and attraction to target precursor vapor for precise deposition on specific areas, combined with a venturi nozzle and inert gas entrainment for efficient delivery and recycling of precursor material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional vapor deposition processes are used, then deposition can occur on surfaces, but line-of-sight transfer constraints limit selective deposition control and unwanted deposition occurs on internal chamber surfaces
Solution Approach 1:
A robotic arm serves as an intermediary between the deposition source and target surfaces, enabling precise positioning and control of the deposition process. The robotic arm carries the deposition tool to specific locations, allowing selective deposition only on intended surfaces while avoiding internal chamber surfaces.
Solution Approach 2:
The system transitions from static deposition to dynamic, robot-controlled deposition. The robotic arm enables real-time positioning adjustments, allowing the deposition process to adapt to complex geometries and achieve selective deposition on both external and internal surfaces without unwanted deposition elsewhere.
2Productivity
If conventional deposition methods are used, then material can be deposited, but deposition rates and efficiency are limited
Solution Approach 1:
The system employs cathodic arc evaporation, which fundamentally changes the vaporization parameters by using electrical discharge to directly vaporize material. This method achieves higher deposition rates compared to conventional thermal evaporation, as the arc discharge efficiently converts electrical energy to material vaporization with minimal energy loss.
Solution Approach 2:
The system replaces conventional thermal/mechanical vaporization methods with electrical field-based cathodic arc evaporation. This substitution enables more efficient energy utilization and higher deposition rates by directly using electrical discharge to vaporize material rather than relying on thermal conduction.
3Manufacturing precision
If selective deposition is achieved through complex positioning, then deposition precision improves, but device complexity increases
Solution Approach 1:
The robotic arm provides multi-functional capability, serving as both a positioning mechanism and a support structure for the deposition tool. This universal platform handles both simple and complex deposition geometries without requiring separate specialized equipment, thereby improving precision without proportionally increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables targeted and controlled deposition on both external and internal surfaces, improving surface quality and mechanical properties, reducing clogging and masking needs, and allowing for in-situ micro-alloying, while enhancing deposition rates and efficiency.
Implementation Method 1
The evaporating of the precursor material may include cathodic arc evaporation
Implementation Method 2
KR 2013 0005163, KR 2013 0007343, DE 25 48 357 and US 2009/288601 disclose vapor deposition apparatus including a nozzle utilizing the venturi effect for accelerating precursor vapor towards a target substrate
Implementation Method 3
The evacuating of the precursor vapor into the nozzle may include flowing an inert gas through the nozzle to entrain the precursor vapor
Implementation Method 4
The accelerating of the precursor vapor through the diffuser may include electro-magnetically repelling the precursor vapor
Implementation Method 5
The method may further include directing electro-magnetic attraction of the precursor vapor toward the target build surface
Implementation Method 6
Chemical vapor deposition (CVD) uses a chemical reaction to produce the vapor which decomposes onto the substrate
Data Source
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AI summary
A selective vapor deposition method is provided and includes evaporating a precursor material (20) in a low vacuum evaporating chamber (12) to produce a precursor vapor (21), evacuating the precursor vapor into a nozzle (130) of a venturi element (13) and accelerating the precursor vapor through a diffuser (131) of the venturi element and toward a target build surface (111).