Vertical Antenna Array Signal Conversion Structure
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Solution Overview
Problem
Conventional millimeter-wave wireless communication systems face challenges in achieving high antenna gain and efficient heat dissipation due to high frequency losses and the complexity of integrating high-gain antenna arrays with flexible layout requirements, particularly in feeding network design for 5G technology.
Innovation Solution
A signal line conversion structure integrating a horizontal dielectric substrate with a vertically installed dielectric substrate and microstrip lines, utilizing metal through holes in a metal connecting plate to transfer signals from the horizontal plane to the antenna array on the vertical plane, minimizing energy loss and increasing heat radiation and antenna gain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a high-gain antenna array is used to compensate for high frequency losses in millimeter-wave communication, then the transmission rate and bandwidth are improved, but the heat generation increases and the layout flexibility becomes more difficult
Solution Approach 1:
The patent transitions from a conventional planar (2D) antenna array layout to a three-dimensional structure by vertically installing the antenna array on the side surface of the dielectric substrate. This spatial transformation allows the antenna elements to be arranged in multiple dimensions, achieving high gain and directional beamforming while distributing heat generation across a larger volume and improving thermal management.
2Quantity of substance
If a large number of antenna elements are integrated to increase antenna gain, then the transmission capacity is improved, but the feeding network design becomes more complex and integration difficulty increases
Solution Approach 1:
The patent divides the feeding network into modular segments, with each antenna element having its own dedicated feeding path through via holes. The signal lines are segmented and routed independently to each antenna element, allowing for simplified design and integration of large-scale antenna arrays. This modular approach reduces the overall system complexity by breaking down the feeding network into manageable, repeatable units.
3Adaptability or versatility
If the antenna array is disposed on the horizontal dielectric substrate to achieve flexible layout, then the layout flexibility is improved, but the heat dissipation space is reduced
Solution Approach 1:
The patent moves the antenna array from a horizontal plane to a vertical orientation on the side surface of the dielectric substrate. This dimensional change provides access to the third dimension (height/depth), enabling both flexible layout adaptation and improved heat dissipation. The vertical arrangement allows heat to dissipate in multiple directions, including downward into the substrate and outward from the side surface, significantly enhancing thermal management while maintaining layout flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances antenna gain, reduces energy loss, and increases heat dissipation, providing flexibility in antenna array layout and improving bandwidth, thus addressing the limitations of conventional systems in high-frequency and high-power applications.
Implementation Method 1
The signal lines are disposed on the first region of the first dielectric substrate and extended to the second dielectric substrate for connecting the circuit substrate with the antenna array
Implementation Method 2
more space is available for dissipating the heat generated in the horizontal dielectric substrate
Data Source
AI summary
A signal line conversion structure of the antenna array is disposed between the antenna array and the circuit substrate, which includes a first dielectric substrate is disposed on the circuit substrate, a second dielectric substrate is vertically disposed on the first dielectric substrate and divided into a first region and a second region, and the second dielectric substrate is provided with the antenna array. At least one signal line is disposed on the first region and extends to the second dielectric substrate for connecting the circuit substrate and the antenna array. A metal connecting plate has at least three metal through holes pierced in the first dielectric substrate and connected to the second ground layer. The metal connecting plate is connected to the first ground layer of the first dielectric substrate and the second ground layer of the second dielectric substrate through the metal through holes.