Vertical Antenna-Chip Wiring Structure for Low-Loss Radar Packaging
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Solution Overview
Problem
Current electronic devices, such as automotive millimeter-wave radar, have separate configurations for antenna units and signal processing chips, leading to increased size and cost.
Innovation Solution
An integrated wiring structure is proposed, where the antenna unit is disposed on a connector electrically connected to the chip, and includes a pattern layer and a covering layer with differing surface roughness to protect the pattern layer and reduce signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the antenna unit and signal processing chip are configured in different areas on the same circuit board, then the device can be manufactured with separate components, but the size of the device becomes larger and the cost increases
Solution Approach 1:
The patent combines the antenna unit and signal processing chip into a vertically integrated structure where the antenna unit is disposed on the connector that is electrically connected to the chip. This merging of previously separate components into a single integrated assembly reduces the overall device volume while maintaining manufacturability through standardized integration processes.
Solution Approach 2:
The patent transitions from a planar horizontal arrangement of antenna and chip to a vertical three-dimensional configuration. By stacking the antenna unit on top of the connector and chip assembly, the design utilizes the vertical dimension to reduce the footprint area and overall device size while preserving electrical connectivity and functional separation.
2Device complexity
If the pattern layer is exposed without protection, then the structure remains simple, but the pattern layer is susceptible to oxidation and signal loss
Solution Approach 1:
The patent employs a composite multi-layer structure consisting of the pattern layer combined with a covering layer. This composite construction provides protective functionality to the pattern layer, preventing oxidation and reducing signal loss, while the overall design remains relatively simple by integrating this protection directly into the existing layer structure without adding complex external protective mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size and cost of electronic devices by integrating the antenna unit and chip vertically, while also protecting the pattern layer from oxidation and minimizing signal loss.
Implementation Method 1
protect the pattern layer from oxidation and minimizing signal loss
Data Source
AI summary
An electronic device is provided. The electronic device includes a protective layer, a chip disposed on the protective layer, a first connector electrically connected to the chip, and an antenna unit disposed on the first connector and electrically connected to the chip. The antenna unit includes a pattern layer and a covering layer disposed on the pattern layer. The pattern layer includes a first surface and the covering layer includes a second surface. The first surface is rougher than the second surface.