Vertical Antenna Substrate via Stacked Conductive Structures
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Solution Overview
Problem
Current antenna substrates for 5G communications require separate cable substrates for vertical antenna structures, leading to signal loss and increased costs, while also being inefficient in manufacturing and implementation.
Innovation Solution
An antenna substrate with a vertical structure is achieved by stacking conductive structures in a vertical direction, eliminating the need for a separate cable substrate, using a body with insulating layers and via layers that connect pattern layers, allowing for direct mounting and efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a separate cable substrate is used to implement vertical antenna structures, then the antenna can be mounted vertically, but signal loss occurs and manufacturing complexity increases
Solution Approach 1:
The patent merges the cable substrate and antenna substrate into a single integrated substrate structure. The antenna elements are formed directly on the substrate using conductive patterns and via holes, eliminating the need for a separate cable substrate. This integration removes the interface between cable and antenna substrates, thereby eliminating signal loss at the connection point while maintaining vertical antenna mounting capability.
2Ease of operation
If a separate cable substrate is used for vertical antenna structures, then mounting is possible, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent combines multiple functions into a single substrate: the substrate serves as both the mounting base and the antenna element carrier. Conductive patterns are formed directly on the substrate, and via holes provide vertical connectivity, eliminating the need for separate cable substrates and reducing manufacturing steps.
Solution Approach 2:
The patent transitions from a planar antenna structure to a three-dimensional structure by utilizing via holes that extend vertically through the substrate. This allows antenna elements to be arranged in multiple layers and orientations, enabling vertical mounting and complex radiation patterns without requiring additional separate components.
3Ease of manufacture
If conventional substrate structures are used, then manufacturing is straightforward, but vertical antenna structures require additional cable substrates
Solution Approach 1:
The patent integrates the antenna elements and substrate into a single manufactured component. The substrate includes integrated conductive patterns formed by standard PCB techniques and via holes created through drilling and plating processes. This eliminates the need for separate cable substrate assembly while maintaining ease of manufacture using conventional fabrication methods.
Data Source
AI summary
An antenna substrate includes a body including an insulating material, a plurality of wiring layers stacked with each other in a first vertical direction in the body, and a plurality of first antenna layers stacked with each other in a third horizontal direction in the body. Each of the plurality of first antenna layers includes a plurality of conductive structures, each having a length in a second horizontal direction greater than a length in the third horizontal direction perpendicular to the second horizontal direction, that are stacked in the first vertical direction.