Interconnection Structure With Vertical Boards for Low-Resistance Cooling
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Solution Overview
Problem
The increasing power consumption and heat dissipation challenges in electronic devices, particularly in systems with high-speed links and complex architectures, are exacerbated by inefficient air cooling systems with high flow resistance and uneven heat distribution.
Innovation Solution
An interconnection structure is designed with a chassis, first and second line boards, and a heat dissipation component, where the second line board is horizontally disposed within the chassis, and first line boards are vertically inserted onto the second line board, reducing system flow resistance and improving heat dissipation by optimizing air duct layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the air cooling system uses a complex architecture with multiple air ducts to accommodate high-power components, then the heat dissipation coverage is improved, but the flow resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent introduces a vertical dimension to the air cooling architecture by inserting line boards vertically into the chassis. This creates vertical air channels that complement the horizontal air ducts, forming a three-dimensional air flow path. The vertical insertion point serves as a shared air channel between horizontal and vertical directions, reducing the total number of separate ducts needed while maintaining comprehensive heat dissipation coverage for high-power components.
2Temperature
If more air duct parts are added to improve heat dissipation coverage, then the heat dissipation capability is improved, but the system complexity and manufacturing difficulty increase
Solution Approach 1:
The vertical insertion point on the line board serves multiple functions simultaneously: it acts as a mounting point for the line board, a connection interface for horizontal air ducts, and an air channel for vertical air flow. This multi-functional design eliminates the need for separate dedicated air duct components for vertical cooling, reducing the total number of parts while maintaining comprehensive heat dissipation capability.
Solution Approach 2:
The patent merges the air channel function into the vertical insertion point structure itself, combining the mechanical mounting function and the thermal management function into a single integrated feature. This integration eliminates the need for separate air duct components for vertical cooling paths, reducing part quantity and simplifying the overall air cooling system architecture.
3Ease of operation
If the line board is inserted horizontally to simplify installation, then the installation convenience is improved, but the air flow resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent adopts vertical insertion of line boards into the chassis, utilizing the vertical dimension to create more efficient air flow paths. This vertical orientation allows air to flow directly through the insertion point in both horizontal and vertical directions, reducing flow resistance compared to horizontal insertion. The vertical insertion point naturally serves as a convergence point for air channels from multiple directions, improving heat dissipation efficiency while maintaining installation convenience through a standardized insertion mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces system flow resistance and enhances heat dissipation capabilities, ensuring uniform heat distribution and improved signal quality in electronic devices.
Implementation Method 1
a heat dissipation component disposed on a first side surface of the chassis
Implementation Method 2
heat dissipation capability of the system
Data Source
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AI summary
This application discloses an interconnection structure used in an electronic device and a method for assembling an interconnection structure, and belongs to the field of electronic technologies. The interconnection structure used in the electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system.