Vertical Buffer System for Semiconductor Load Ports
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Solution Overview
Problem
High-throughput semiconductor device fabrication line tools face idle time and starvation due to insufficient sealable container availability at load ports, which is not adequately addressed by existing buffer systems, as they require advanced process flow optimization and efficient storage solutions to minimize processing and delivery time variations.
Innovation Solution
A buffer system incorporating retractable shelves, sliding assemblies, and lifting assemblies to efficiently transport and position sealable containers between load ports and storage locations within a vertical plane, optimizing space utilization and reducing maintenance requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of load ports is increased to reduce starvation, then sealable container availability improves, but space consumption increases and operational expenses rise
Solution Approach 1:
The patent transitions from horizontal expansion (adding more load ports side-by-side) to vertical expansion (stacking load ports vertically). The buffer system utilizes vertical space by positioning multiple load ports at different heights, allowing the system to increase container capacity without consuming additional floor space. This dimensional shift resolves the contradiction between improving reliability and reducing space consumption.
Solution Approach 2:
The buffer system employs a nested structure where multiple load ports are vertically stacked and integrated within a compact vertical footprint. The retractable shelves are nested within the vertical buffer structure, allowing containers to be stored in multiple levels. This nesting approach enables the system to provide increased container availability while maintaining a compact spatial footprint.
2Productivity
If the number of load ports is increased to eliminate starvation, then processing continuity improves, but maintenance requirements increase
Solution Approach 1:
The buffer system incorporates retractable shelves that can dynamically extend and retract to accommodate different operational states. This dynamic mechanism allows the system to adapt to varying throughput demands without requiring a fixed increase in load ports. The retractable nature simplifies maintenance by reducing the number of permanently fixed components and allowing easier access to internal mechanisms.
Solution Approach 2:
The vertical buffer system serves multiple functions: it acts as both a storage buffer and an active transport mechanism. The same vertical structure provides both container storage on retractable shelves and facilitates transfer between different process stages. This multi-functionality reduces the need for separate dedicated components, thereby lowering overall maintenance requirements while maintaining processing continuity.
3Loss of time
If buffer capacity is increased to reduce idle time, then throughput improves, but device complexity increases
Solution Approach 1:
By utilizing the vertical dimension for buffer capacity expansion, the system achieves increased storage capability without proportionally increasing horizontal complexity. The vertical stacking of load ports and retractable shelves provides a more compact and manageable buffer structure compared to horizontal expansion, thereby improving throughput while controlling device complexity.
Solution Approach 2:
The retractable shelves act as intermediaries between the vertical buffer storage and the load ports. Instead of requiring direct complex mechanisms for every container transfer, the retractable shelves serve as intermediate platforms that simplify the transfer process. This intermediary approach reduces overall system complexity while effectively reducing idle time and improving throughput.
Data Source
AI summary
A buffer system for a semiconductor device fabrication tool includes one or more retractable shelves, one or more sliding assemblies positionable above the one or more load ports of the semiconductor device fabrication tool, and one or more lifting assemblies. The one or more retractable shelves are configured to support sealable containers. The one or more sliding assemblies are configured to receive the sealable containers and are further configured to transport the sealable containers to one or more positions beneath the one or more retractable shelves. The one or more lifting assemblies are configured to transport the sealable containers between any two of the group including one or more retractable shelves, the one or more sliding assemblies, and the one or more load ports.