Vertical Channel Transistor String Body Connection
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Solution Overview
Problem
The integration of semiconductor memory devices is limited by the floating of vertical channels in transistors, leading to hole accumulation and leakage currents, which deteriorate data retention properties.
Innovation Solution
A semiconductor device with active pillars and a string body connection portion that connects channel regions of adjacent pillars, using a conductivity type matching the channel region, and an insulating gap-fill pattern to prevent channel floating, along with a voltage generation portion to manage voltages applied to the string body connection and substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a vertical transistor with vertically spaced source and drain regions is used, then integration density is improved, but the channel region becomes floating leading to hole accumulation and leakage current
Solution Approach 1:
A string body connection portion is introduced as an intermediary element to connect the channel regions of adjacent vertical transistors. This connection portion provides a conductive pathway that prevents the channel from floating, thereby eliminating hole accumulation and leakage current while preserving the high integration density achieved through vertical transistor architecture
Solution Approach 2:
Adjacent channel regions are merged through the string body connection portion, creating a continuous conductive structure. This merging approach allows multiple vertical transistors to share a common potential reference, preventing floating effects without requiring individual isolation structures for each transistor
2Device complexity
If the channel region is left floating to simplify structure, then device complexity is reduced, but leakage current increases and data retention deteriorates
Solution Approach 1:
The string body connection portion serves as a mediator that connects adjacent channel regions, providing a controlled conductive path. This intermediary structure prevents harmful floating effects and leakage currents while adding minimal structural complexity to the device
Data Source
AI summary
According to example embodiments, a semiconductor device includes a plurality of active pillars protruding from a substrate. Each active pillar includes a channel region between upper and lower doped regions. A contact gate electrode faces the channel region and is connected to a word line. The word line extends in a first direction. A bit line is connected to the lower doped region and extends in a second direction. The semiconductor device further includes a string body connection portion that connects the channel region of at least two adjacent active pillars of the plurality of active pillars.


