Vertical Circuit Assemblies for Compact Power Converter Footprints
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Solution Overview
Problem
Current circuit assemblies for power converters occupy large footprints on printed circuit boards, limiting the ability to increase peak power levels in devices without significant increases in PCB area.
Innovation Solution
The development of vertical circuit assemblies that include a leadframe with bent and straight pins, a multi-chip assembly, an output inductor, and a molding compound, arranged in a stacked configuration, allowing for reduced footprint by enabling both surface and through-hole mounting, thereby integrating high-side and low-side FETs, control circuits, and passive components in a compact form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional horizontal circuit assemblies are used, then the circuit functionality is achieved, but the PCB footprint area is large
Solution Approach 1:
The patent transitions from horizontal PCB mounting to vertical three-dimensional stacking configuration. Multiple circuit components (leadframes, semiconductor die, inductor) are arranged vertically in stacked layers rather than horizontally on the PCB surface, reducing the footprint area while maintaining circuit functionality through vertical integration.
Solution Approach 2:
The patent implements nested packaging where semiconductor die are mounted on substrates, which are then mounted on leadframes, which are encapsulated in molding compound. The inductor is positioned within the vertical stack among other components. This nested arrangement consolidates multiple components into a compact vertical structure, significantly reducing the required PCB area.
2Area of stationary object
If vertical stacked configuration is used, then the PCB footprint area is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary assembly of semiconductor die on substrates, and mounting of the substrate assembly on leadframes before final PCB installation. The molding compound is applied to encapsulate components prior to PCB mounting. These preliminary actions organize components into pre-assembled modules, simplifying the final PCB assembly process despite the complex vertical structure.
Solution Approach 2:
The patent combines multiple discrete components (semiconductor die, substrate, leadframe, inductor, molding compound) into a single integrated vertical circuit assembly package. This merging creates a unified module that functions as one assembly unit, reducing the number of separate manufacturing steps required on the PCB while maintaining the complex internal vertical structure.
Data Source
AI summary
In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.