Vertical Clip Package for Compact Electronic Component Stacking
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Solution Overview
Problem
Conventional packages face challenges in terms of space consumption and reliability, particularly in achieving a compact footprint while maintaining high integration density and manufacturing simplicity.
Innovation Solution
A package design featuring two vertically extending electronic components with exposed terminals, accommodated and held together by a clip, allowing terminal access at the clip's bottom, thereby reducing spatial dimensions and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional packages use horizontal mounting of electronic components, then ease of manufacture is improved, but package footprint area increases
Solution Approach 1:
The patent transitions from horizontal mounting to vertical stacking of electronic components, utilizing the third dimension (height) to reduce the footprint area. Multiple components are arranged vertically within a single package body, allowing more components to be integrated in a smaller planar space while maintaining manufacturing feasibility through automated placement processes.
Solution Approach 2:
The patent implements nested arrangement where electronic components are stacked vertically one above another within the package body, similar to nested dolls. This space-efficient configuration allows components to be accommodated in a compact vertical arrangement, reducing the overall package footprint while maintaining accessibility to all components.
2Area of stationary object
If vertical arrangement of electronic components is used, then package footprint is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the package into modular segments with standardized component interfaces and stacking positions. This segmentation allows for systematic assembly processes where components can be placed in a structured manner, reducing manufacturing complexity despite the vertical arrangement. The modular design enables automated assembly equipment to handle the vertical stacking efficiently.
3Quantity of substance
If more electronic components are integrated in a smaller area, then integration density is improved, but thermal management difficulty increases
Solution Approach 1:
The patent applies local quality by providing targeted thermal management solutions at specific locations where heat-generating components are positioned. Different thermal management approaches are applied to different components based on their thermal characteristics, such as using thermal vias, heat sinks, or thermal pads at critical hot spots while maintaining compact overall packaging.
Data Source
AI summary
A package includes: a vertically extending first electronic component with at least one exposed electrically conductive first terminal; a vertically extending second electronic component with at least one exposed electrically conductive second terminal; and a clip with an accommodation volume in which the first electronic component and the second electronic component are accommodated and are held together. The at least one first terminal and the at least one second terminal are electrically accessible at a bottom of the clip.