Vertically Stacked Coating and Developing Apparatus for Semiconductor Yield
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Solution Overview
Problem
The increasing complexity of semiconductor manufacturing processes for finer resist patterns and higher yield leads to a larger footprint of coating and developing apparatuses, which results in reduced operation efficiency due to the need to stop the entire system for abnormalities or maintenance in individual processing modules.
Innovation Solution
A coating and developing apparatus with vertically stacked coating and developing unit blocks, each equipped with transport mechanisms and transfer units, allowing for partial operation cessation and efficient substrate handling to minimize downtime and maintain productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple diverse processing modules are provided in a processing block to meet demands for finer resist patterns and higher yield, then manufacturing precision and reliability are improved, but the footprint of the apparatus increases
Solution Approach 1:
The patent transitions from a horizontal arrangement of processing modules to a vertical stacking configuration. Multiple unit blocks containing diverse processing modules (coating film-forming modules, developing modules, heating modules, etc.) are stacked in the vertical direction, allowing the apparatus to maintain comprehensive processing capabilities while reducing the horizontal footprint area.
Solution Approach 2:
The processing block is segmented into multiple independent unit blocks, each containing specific processing modules. These unit blocks can be vertically stacked and independently operated, enabling modular expansion of processing capabilities without proportionally increasing footprint, as modules are arranged in three-dimensional space rather than purely horizontal layout.
2Area of stationary object
If unit blocks are vertically stacked to reduce footprint, then area of stationary object is reduced, but the entire apparatus must stop when abnormality occurs in one module, reducing productivity
Solution Approach 1:
The processing block is divided into multiple independent unit blocks (first unit block, second unit block, third unit block, etc.), each capable of independent operation. When an abnormality occurs in one unit block, other unit blocks can continue processing wafers, allowing partial operation rather than complete system shutdown, thus maintaining productivity.
Solution Approach 2:
The patent implements dynamic wafer routing capabilities where the transport mechanism can adaptively redirect wafers based on the operational status of different unit blocks. When one block is abnormal, the system dynamically reroutes wafers through alternative blocks, enabling flexible operation and preventing complete system stoppage.
3Reliability
If diverse processing modules are added for back surface cleaning and liquid processing, then manufacturing precision and reliability are improved, but device complexity increases
Solution Approach 1:
Different processing functions (coating film-forming, developing, heating, back surface cleaning, liquid processing) are segmented into separate unit blocks. Each unit block is designed with specific modules for its function, making the complex system manageable through modular organization. This segmentation allows each module to be independently controlled and maintained, reducing overall system complexity despite the diversity of functions.
Solution Approach 2:
The unit blocks are designed with universal interfaces and standardized transport mechanisms that can handle multiple types of processing modules. The transport mechanism and control system can accommodate various processing functions within the same architectural framework, reducing the complexity that would otherwise arise from completely separate systems for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the apparatus' footprint while enabling efficient operation by allowing selective stopping of units in case of abnormalities or maintenance, thus maintaining high operational efficiency.
Implementation Method 1
a heating module for heating the substrate
Data Source
Figure 1
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AI summary
In one embodiment, a coating and developing apparatus includes a processing block having at least one coating film-forming unit block stack and a developing unit block stack which are vertically stacked on each other. Each unit block stack is composed of unit blocks vertically stacked on each other, and each unit block includes processing modules containing liquid processing modules and heating modules, each unit block is provided therein with a transport mechanism that moves along a transport passage, extending linearly from a carrier block side to an interface block side, to transport the substrate between the processing modules belonging to the unit block. First transfer units are each provided on the carrier block sides of the coating film-forming unit blocks and the developing unit blocks respectively, for transferring the substrate to and from the transport mechanism of the associated coating film-forming block or developing unit block. A first transfer mechanism transfers a substrate removed from a carrier to one of the first transfer units associated with the coating film-forming unit blocks.