Vertical Electronic Component Fixing Structure for High Density Mounting
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Solution Overview
Problem
The existing fixing structures for electronic devices are inefficient in space utilization due to the larger side surface of electronic components like HFE9 relays, which occupy excessive space on substrates, limiting the number of components that can be mounted.
Innovation Solution
A fixing structure that vertically mounts electronic components on a substrate using second pins engaging with second connecting holes on a second substrate, which is then secured by a fixing mechanism with first pins engaging first connecting holes on the main substrate, allowing for reduced space occupation and increased component density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are mounted horizontally with pins inserted into substrate holes, then electrical connection is achieved, but the occupied area on the substrate increases
Solution Approach 1:
The patent transitions from horizontal mounting to vertical mounting of electronic components on the substrate. The component body stands upright with its bottom surface contacting the substrate, and pins extend vertically to engage with holes in the substrate. This dimensional change from horizontal to vertical orientation reduces the footprint area occupied by each component while maintaining electrical connectivity through the vertical pin-to-hole engagement.
2Productivity
If more electronic components are arranged on the substrate, then space utilization rate increases, but the side surface area of each component must be reduced
Solution Approach 1:
By mounting components vertically rather than horizontally, the effective footprint area of each component on the substrate is reduced to primarily the bottom surface area, rather than the larger side surface area required for horizontal mounting. This enables higher component density and improved space utilization rate on the substrate.
3Area of stationary object
If electronic components are vertically mounted to reduce occupied area, then space utilization rate increases, but a fixing mechanism is required to secure the components
Solution Approach 1:
The fixing mechanism is integrated with the substrate structure itself. The substrate includes vertically extending fixing holes that receive and secure the mounting portions of the vertically mounted components. This merging of the fixing function into the substrate eliminates the need for separate fixing structures, reducing overall device complexity while enabling vertical mounting for reduced footprint.
Data Source
AI summary
A fixing structure of electronic components has a first substrate, at least one second substrate, at least one electronic component, and at least one fixing mechanism. Each second substrate has at least two first pins to electrically connect to the first substrate. Multiple second pins formed on a side surface of the electronic component are electrically connected to the second substrate. The at least one fixing mechanism covers the at least one electronic component and the at least one second substrate. A first mounting part and a second mounting part respectively extend downward from opposite sides of the at least one fixing mechanism for clamping the electronic component and the second substrate so that the at least one electronic component and the at least one second substrate are erectly mounted on the first substrate. Thus, more electronic components are allowed to be erectly mounted on the first substrate.