Vertical Component Embedding in Package Substrates for Coplanarity
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Solution Overview
Problem
Embedding circuit components within a package substrate core is challenging due to thickness mismatches, leading to tilting and shifting issues, which affect connectivity and density.
Innovation Solution
Vertically embedding circuit components within the core layer, with conductive contacts on an edge orthogonal to the core layer plane, allowing for better thickness matching and coplanarity, and enabling electrical connections through the component itself.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If circuit components are embedded horizontally within the core layer, then the component can be integrated into the substrate, but thickness mismatches occur leading to tilting and shifting of the component
Solution Approach 1:
The patent transitions from horizontal embedding to vertical embedding of circuit components within the core layer. By changing the embedding orientation from in-plane (horizontal) to out-of-plane (vertical), the component's thickness dimension aligns with the core layer thickness, eliminating thickness mismatches and the associated tilting and shifting problems while maintaining integration capability
Solution Approach 2:
The patent introduces asymmetric positioning structures including angled support features and non-uniform cavity geometries that specifically address the vertical embedding configuration. These asymmetric elements provide targeted support at critical locations to prevent component shifting and ensure proper orientation during the embedding process
2Ease of manufacture
If circuit components are embedded horizontally within the core layer, then integration is achieved, but component density is limited due to tilting and shifting issues
Solution Approach 1:
By switching to vertical embedding, the patent enables more efficient space utilization within the core layer volume. The vertical orientation allows components to be stacked or arranged in three-dimensional configurations rather than being constrained to a single plane, thereby increasing the quantity of components that can be integrated into the substrate
Solution Approach 2:
The patent implements nested arrangements where multiple circuit components are vertically stacked or positioned within nested cavities in the core layer. This nesting approach maximizes the use of available substrate volume and enables higher component density while maintaining proper electrical connections and mechanical support
3Ease of manufacture
If the component width is not controlled, then manufacturing is simpler, but thickness mismatches between the core layer and component occur
Solution Approach 1:
The patent implements controlled parameter specifications for component dimensions, particularly the width and thickness parameters, to ensure they match the core layer thickness. By establishing specific parameter ranges and tolerances during component fabrication, the patent achieves precise thickness matching while maintaining manufacturability through standardized production processes
Solution Approach 2:
The patent introduces intermediary structures such as adhesive layers, support features, and transition regions between the component and core layer. These intermediary elements act as mediators that accommodate minor dimensional variations and ensure proper thickness matching without requiring extremely tight component fabrication tolerances
Data Source
AI summary
In embodiments herein, circuit components are embedded within a core layer of a substrate. The circuit components are vertically oriented within a cavity or hole of the core layer of the substrate, e.g., with conductive contacts on an edge of the component that is substantially orthogonal to a plane of the core layer. The edge that is substantially orthogonal to a plane of the core layer may be the longest edge of the component.