Vertical Component Embedding in Package Substrates for Higher Density
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Solution Overview
Problem
Embedding circuit components within a package substrate core is challenging due to thickness mismatches, leading to tilting and shifting issues, which affect connectivity and density.
Innovation Solution
Vertically embedding circuit components within the core layer, aligning their longer dimensions with the substrate's thickness, and using redistribution layers and metallization layers to establish electrical connections, allowing for better thickness matching and increased density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If circuit components are embedded horizontally within the core layer, then the component width can be controlled during manufacturing, but thickness mismatches occur leading to tilting and shifting of components
Solution Approach 1:
The patent transitions from horizontal embedding to vertical embedding of circuit components within the core layer. By changing the embedding orientation from horizontal to vertical, the component's thickness dimension aligns with the core layer thickness, eliminating thickness mismatches and preventing tilting and shifting issues while maintaining manufacturing precision through controlled component width.
2Device complexity
If circuit components are embedded within the core layer, then component integration is achieved, but component density is limited due to thickness mismatches and positioning issues
Solution Approach 1:
By switching from horizontal to vertical embedding orientation, the patent enables better utilization of the core layer volume. The vertical orientation allows components to be stacked or arranged more efficiently, increasing the quantity of components that can be integrated within the same core layer thickness, thereby improving component density while maintaining integration.
Solution Approach 2:
The patent changes the embedding orientation parameter from horizontal to vertical, which fundamentally alters how components occupy space within the core layer. This parameter change resolves thickness mismatch issues and enables higher component density by allowing more components to be packed into the available volume without compromising positioning stability.
3Manufacturing precision
If vertically embedded components are used, then thickness mismatches are mitigated and coplanarity is improved, but electrical connection complexity increases
Solution Approach 1:
The vertical embedding orientation changes the spatial relationship between components and the core layer, achieving coplanarity by aligning component thickness with core layer thickness. The electrical connection complexity is managed by routing connections through the vertical structure, where conductive vias or traces can connect to the vertical faces of embedded components, transforming the connection challenge into a three-dimensional routing problem that can be solved with standard PCB techniques.
Data Source
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Figure 3A~3B
AI summary
In embodiments herein, circuit components are embedded within a core layer of a substrate. The circuit components are vertically oriented within a cavity or hole of the core layer of the substrate, e.g., with conductive contacts on an edge of the component that is substantially orthogonal to a plane of the core layer. The edge that is substantially orthogonal to a plane of the core layer may be the longest edge of the component.