Vertical Cooling Chip Heat Sink for EV Power Device Thermal Management
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Solution Overview
Problem
Conventional power heat dissipation devices for electric vehicles face challenges in efficiently dissipating heat generated by high-performance power devices, particularly at peak outputs, leading to reduced performance and potential overheating or failure.
Innovation Solution
A power heat dissipation device comprising a heat-conducting layer, a heat sink with a heat-conducting section, and vertically embedded cooling chips that are perpendicular to the heat-absorbing surface, allowing for enhanced heat transfer and reduced blockage of heat paths, enabling effective heat removal from power devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat dissipation device is designed large in size to dissipate heat at peak output, then heat dissipation capability is improved, but device size increases
Solution Approach 1:
The cooling chips are arranged vertically in the height direction of the heat sink rather than horizontally, utilizing the third dimension (Z-axis) for heat dissipation component placement. This vertical arrangement allows multiple cooling chips to be stacked along the height direction, increasing heat dissipation capability without proportionally increasing the horizontal footprint area of the device.
Solution Approach 2:
The cooling chips are embedded within the heat sink structure, with the heat-conducting sections of the heat sink surrounding and thermally connecting to the cooling chips. This nested arrangement integrates the cooling function within the existing heat sink volume, maximizing heat dissipation efficiency within a compact form factor.
2Temperature
If more cooling chips are added to increase heat dissipation, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The heat sink is divided into multiple independent heat-conducting sections, each containing or adjacent to a cooling chip. This segmentation allows multiple cooling chips to be distributed throughout the heat sink structure, with each chip handling heat from specific regions, thereby increasing overall heat dissipation capability while maintaining modular simplicity in the overall design.
3Temperature
If cooling chips are placed horizontally in the heat sink, then heat dissipation is improved, but heat transfer blockage increases
Solution Approach 1:
The cooling chips are oriented vertically with their cooling surfaces facing upward, perpendicular to the heat-absorbing surface of the heat-conducting layer. This vertical orientation allows heat to conduct upward from the power device through the heat-conducting layer and heat-conducting sections without being blocked by the cooling chips, as the chips are positioned above rather than alongside the heat flow path. The cooling chips draw heat upward from the heat-conducting sections without interfering with the primary heat flow from the power device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat dissipation capabilities, reducing the risk of overheating and enhancing the performance and reliability of power devices by minimizing heat transfer blockage and accommodating more cooling chips for increased efficiency.
Implementation Method 1
The cooling chip removes heat form the heat-conducting section in the heat sink
Implementation Method 2
The heat sink is in thermal contact with the heat-dissipating surface of the heat-conducting layer
Data Source
AI summary
A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is formed in the heat sink. The cooling chip is embedded in the heat sink and disposed adjacent to the heat transferring channel. The cooling chip has a cooling surface which is perpendicular to the heat-absorbing surface. The cooling surface faces the heat transferring channel. The cooling chip removes heat from the heat-conducting section in the heat sink.