Vertically Stacked Cooling Units for Double-Sided Chip Modules
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Solution Overview
Problem
Conventional cooling systems for power modules in miniaturized inverters face challenges in maintaining consistent cooling performance due to varying refrigerant flow paths, leading to inefficiencies in heat management, particularly in space-constrained electric vehicle applications.
Innovation Solution
A cooling apparatus with vertically stacked cooling units and headers, featuring extruded tube main bodies with uniform cross-section cooling flow paths and a heat-radiating adhesion portion to maintain contact with double-sided chip modules, ensuring effective cooling of both surfaces and minimizing air gaps, while using O-rings for sealing and fastening bolts for assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional flow path structure is used with simply opened refrigerant flow paths, then the device complexity is reduced, but the cooling performance becomes inconsistent across different local positions
Solution Approach 1:
The patent applies local quality by varying the flow path cross-sectional area at different locations within the cooling plate. Specifically, the flow path has a first cross-sectional area at the inlet and a second cross-sectional area at the outlet, with the ratio between them being 0.5 to 2.0. This local variation in flow path geometry ensures consistent cooling performance across different local positions by compensating for pressure drops and flow distribution issues that would otherwise occur in uniformly sized flow paths.
2Volume of moving object
If the inverter size is reduced for space-constrained applications, then the adaptability to vehicle platforms is improved, but the cooling performance may be compromised due to reduced space for cooling components
Solution Approach 1:
The patent transitions from a conventional horizontal flow path arrangement to a vertical flow path structure where the refrigerant flows in the vertical direction through the cooling plate. This dimensional change allows for more efficient heat transfer and better cooling performance within a compact volume, as the vertical orientation maximizes the use of gravitational flow and improves the surface area to volume ratio for heat dissipation.
Solution Approach 2:
The patent optimizes the flow path cross-sectional area ratio parameter (set between 0.5 to 2.0 between inlet and outlet areas) to achieve consistent cooling performance. By carefully controlling this geometric parameter, the system maintains effective cooling in a miniaturized inverter design, allowing space reduction without compromising thermal management reliability.
3Reliability
If a separation cooling tube structure is used to increase refrigerant amount, then the cooling efficiency is improved, but the device complexity and space requirements increase
Solution Approach 1:
The patent merges the cooling function directly into the power conversion device by integrating the cooling plate with the housing structure. Instead of using separate cooling tubes and independent cooling systems, the cooling plate is formed as an integrated component that combines structural support and thermal management functions, thereby maintaining high cooling efficiency while reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling performance by maintaining consistent contact between cooling units and chip modules, suppressing air gaps and improving heat management, thus optimizing the size and efficiency of power modules in miniaturized inverters.
Implementation Method 1
each body of the plurality of tube main bodies defining a cooling flow path that passes through an inside of the tube main body for flowing a cooling water
Implementation Method 2
heat exchange is performed between the refrigerant flowing in the flow path in the plate and an electronic component, and the electronic component is cooled
Implementation Method 3
a heat-radiating adhesion portion configured to attach the double-sided chip module to the cooling unit
Data Source
AI summary
A cooling apparatus includes: a plurality of cooling units each including a plurality of tube main bodies and a plurality of headers, each tube main body defining a cooling flow path that passes through an inside of the tube main body, and each header being disposed at both sides of the tube main body and vertically assembled based on the plurality of tube main bodies being stacked to thereby connect the cooling flow paths, a double-sided chip module disposed between at least two cooling units, and a heat-radiating adhesion portion attaching the double-sided chip module to the cooling unit. A set distance between the cooling unit and the double-sided chip module is maintained based on the plurality of headers being vertically assembled in contact with each other and equal to or less than a thickness of the heat-radiating adhesion portion.