Vertical Die Bonding Layout for Dust-Controlled Panel Packaging
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Solution Overview
Problem
Panel level packaging of semiconductor devices faces challenges such as dust management, low throughput, and inefficiencies in die bonding processes, including long wafer changeover times and inaccuracies in die placement, which hinder the effectiveness and efficiency of the die bonding process.
Innovation Solution
A die bonding apparatus is designed with a carrier support unit, wafer feed unit, die transfer module, and sensing arrangement to efficiently bond semiconductor dies to a carrier panel, featuring vertical orientation of the carrier panel to minimize dust accumulation, reduced travel distance for dies, and concurrent pre-bond and post-bond inspections to enhance accuracy and throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional wafer level packaging is used, then dust management is easier, but packaging volume and throughput are limited
Solution Approach 1:
The patent transitions from horizontal wafer placement to vertical wafer orientation, changing the dimensional arrangement of the packaging process. The wafer is held vertically with the bonding surface facing the carrier panel, which allows gravity to work in favor of dust removal rather than allowing dust to settle on the bonding surface. This dimensional change enables both high throughput and dust management simultaneously.
Solution Approach 2:
The patent inverts the conventional horizontal bonding approach by using vertical wafer orientation. Instead of placing the wafer horizontally on a carrier, the wafer is held vertically and bonded to the carrier panel in an inverted configuration. This inversion allows dust to fall away from the bonding interface due to gravity, solving the dust contamination problem while maintaining high throughput capability.
2Adaptability or versatility
If wafer changeover is performed frequently, then adaptability increases, but machine utilization time is reduced
Solution Approach 1:
The patent implements a dual-wafer holder system where one wafer can be prepared or changed while the other is being bonded. This preliminary action allows the system to maintain continuous operation by having a standby wafer ready, thereby reducing the effective changeover time and maintaining high machine utilization while preserving adaptability.
Solution Approach 2:
The patent ensures continuous bonding operation by implementing a wafer changeover mechanism that does not interrupt the bonding process. The dual-wafer holder system allows one wafer to be in use while another is being prepared, eliminating idle time and maintaining continuous useful action during wafer changes, thus reducing time loss while preserving adaptability.
3Productivity
If die transfer distance is reduced, then bonding speed increases, but positioning accuracy becomes more challenging
Solution Approach 1:
The patent incorporates a vision system that provides real-time feedback on die position and orientation during the transfer process. This feedback mechanism allows the system to compensate for positioning errors even when transfer distances are reduced, maintaining high placement accuracy while achieving fast bonding speeds through optimized transfer paths.
Solution Approach 2:
The patent replaces purely mechanical positioning systems with an integrated vision-guided system. The vision system uses optical fields and image processing to detect and correct positioning errors, substituting mechanical precision requirements with optical measurement and control, thereby enabling fast transfers with maintained accuracy.
4Reliability
If inspection is performed after bonding, then quality control is ensured, but throughput is reduced
Solution Approach 1:
The patent performs inspection activities before the bonding process completes, including pre-bond inspection of the wafer surface and die positioning. This preliminary action allows potential defects to be identified and corrected before they affect the final bond quality, ensuring reliability while maintaining throughput by avoiding rework and secondary inspection cycles.
Solution Approach 2:
The patent implements continuous inspection throughout the bonding process rather than performing separate pre- and post-bond inspection steps. The vision system operates continuously to monitor die positioning, transfer, and bonding, ensuring quality control without interrupting the bonding flow, thereby maintaining both reliability and high throughput.
Data Source
AI summary
A die bonding apparatus including: a carrier support unit having at least one support element defining a supporting plane and a carrier holder operable to support the carrier panel on a side of the supporting plane with the carrier panel being parallel to the supporting plane; a wafer feed unit having a wafer holder operable to hold a diced wafer in a manner so as to space the diced wafer apart from the supporting plane defined by the at least one support element of the carrier support unit and orient the diced wafer with an exposed surface of the diced wafer facing the side of the supporting plane to which the carrier panel is supported; and a die transfer module disposed between the carrier support unit and the wafer feed unit, the die transfer module operable to transfer a die from the diced wafer to the carrier panel.