Vertical Discrete Devices for Stackable Semiconductor Package Density
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Solution Overview
Problem
Conventional semiconductor packages with laterally-oriented discrete passive devices consume significant substrate area, limiting placement density and requiring complex manufacturing processes.
Innovation Solution
A method for forming stackable semiconductor packages with vertically-oriented discrete electrical devices and bumps as interconnect structures, allowing for a simpler and cost-effective electrical interconnect by mounting semiconductor dies on a substrate with discrete devices oriented vertically and encapsulating them to expose terminals, thereby maximizing placement density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laterally-oriented discrete passive devices are mounted on substrate, then electrical connectivity is achieved, but substrate area consumption increases significantly
Solution Approach 1:
The patent transitions from lateral mounting of discrete passive devices to vertical mounting, changing the spatial dimension from two-dimensional planar arrangement to three-dimensional vertical arrangement. This allows devices to be stacked above the substrate surface rather than spread across it, dramatically reducing the footprint on the substrate while maintaining electrical connectivity through vertical interconnect structures.
2Reliability
If laterally-oriented discrete passive devices are mounted on substrate, then electrical connectivity is achieved, but placement density is limited
Solution Approach 1:
By mounting discrete passive devices vertically on the substrate rather than laterally, the patent enables multiple devices to be stacked in the vertical dimension. This three-dimensional arrangement significantly increases the number of devices that can be placed per unit area of substrate, thereby improving placement density while maintaining electrical connectivity through vertical interconnects.
3Reliability
If complex manufacturing processes are used for lateral device mounting, then electrical connectivity is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent inverts the conventional approach by mounting discrete passive devices vertically rather than laterally on the substrate. This inversion simplifies the manufacturing process because vertical mounting allows for more straightforward alignment and connection to vertical interconnect structures, eliminating complex lateral routing and reducing the number of manufacturing steps required to achieve electrical connectivity.
Data Source
AI summary
A semiconductor device has a substrate and first semiconductor die to the substrate. A plurality of vertically-oriented discrete electrical devices, such as a capacitor, inductor, resistor, diode, or transistor, is mounted over the substrate in proximity to the first semiconductor die. A first terminal of the discrete electrical devices is connected to the substrate. A plurality of bumps is formed over the substrate adjacent to the discrete electrical devices. An encapsulant is deposited over and between the first semiconductor die and substrate. A portion of the bumps and a second terminal of the discrete electrical devices is exposed from the encapsulant. An interconnect structure is formed over a surface of the substrate opposite the first semiconductor die. The semiconductor devices are stackable and electrically connected through the substrate, discrete electrical devices, and bumps. A heat spreader or second semiconductor die can be disposed between the stacked semiconductor devices.