Vertical Flow Reaction Chamber for Chemical Tail Removal

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Solution Overview

Problem

In substrate processing methods, particularly in chemical deposition and etching, the tails of reactive chemicals can persist and deteriorate process quality, leading to suboptimal results.

Innovation Solution

A substrate processing apparatus with a vertical flow reaction chamber and a flow guiding part that forces the vertical flow to go around it, creating a curved flow path with turns, which helps in preventing the tails of reactive chemicals from reaching the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a vertical flow reaction chamber is used for chemical deposition and etching, then the process simplicity and productivity are improved, but the tails of reactive chemicals persist and deteriorate process quality

Engineering Contradiction:
Improveprocess efficiencyVSAvoidprocess quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent introduces a flow guiding part with a curved surface that forces the vertical gas flow to follow a curved path with at least one turn upstream of the substrate support. This curvature modifies the flow dynamics to effectively remove chemical tails, resolving the contradiction between maintaining simple vertical flow for productivity and eliminating chemical tails for process quality.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If process chemicals are fed into the reaction chamber in pulses, then the deposition and etching processes are improved, but the tails of previously entered chemicals are not effectively removed

Engineering Contradiction:
Improveprocess controlVSAvoidchemical tails
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The flow guiding part is positioned upstream of the substrate support to preliminarily modify the gas flow path before the chemicals reach the substrate. This preliminary curvature action effectively removes chemical tails during the pulsing process, preventing contamination while maintaining reliable process control.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If the flow path is curved with turns upstream of the substrate, then chemical tails are consumed and process quality is enhanced, but the device complexity increases due to the flow guiding part

Engineering Contradiction:
Improveprocess qualityVSAvoidapparatus structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The flow guiding part acts as an intermediary element between the gas inlet and the substrate support. This single intermediate component with a curved surface effectively modifies the entire flow field to consume chemical tails, achieving process quality enhancement without requiring complex multi-component systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively consumes the tails of previous process chemicals, enhancing process quality by reducing particle generation and stabilizing the precursor flow and temperature.

Implementation Method 1

the flow guiding part forcing the vertical flow from above the flow guiding part to go round the flow guiding part on its downward way towards the substrate support

Methodology Applied
Scientific EffectFluid flow:

Data Source

PatentUS12297535B2Substrate processing methods and apparatus
Publication Date: 2025.05.13 PICOSUN OY
  • US12297535B2 patent drawing
  • US12297535B2 patent drawing
  • US12297535B2 patent drawing

AI summary

A method and a substrate processing apparatus including a vertical flow reaction chamber, a flow guiding part and a substrate support at a horizontally central area of the reaction chamber, the substrate support residing underneath the flow guiding part, and the flow guiding part forcing the vertical flow from above the flow guiding part to go round the flow guiding part on its downward way towards the substrate support.