Vertical Galvanic Deposition Anode with Through-Going Conduits
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Solution Overview
Problem
Existing devices for vertical galvanic metal deposition, such as copper, suffer from non-uniform deposition and difficulties in filling blind holes without generating voids or gases, leading to issues like short circuits in substrates like semiconductor wafers and printed circuit boards.
Innovation Solution
A device with a first anode element and a carrier element, both having through-going conduits, are arranged vertically and connected to ensure a constant volume flow of electrolytic solution, allowing uniform deposition on substrates and effective filling of blind holes by controlling the electric field and volume flow speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional disk-like anodes with diffuser plates are used, then the device structure is simple, but the metal deposition uniformity is poor
Solution Approach 1:
The anode is divided into multiple segments arranged in a specific pattern, with each segment having through-going conduits for electrolyte flow. This segmentation allows different regions of the substrate to receive optimized electrolyte flow and current density, improving deposition uniformity while maintaining manageable device complexity
Solution Approach 2:
The device provides different electrolyte flow conditions and current densities to different regions of the substrate by positioning anode segments and conduits strategically. This local optimization ensures uniform deposition across the entire substrate surface, addressing the non-uniformity problem without requiring complete structural redesign
2Reliability
If traditional electroplating devices are used, then the device structure is simple, but the blind hole filling capability is poor with voids and gases
Solution Approach 1:
The device uses hydraulic flow of electrolyte through the through-going conduits in the anode segments to directly reach and fill blind holes. The controlled electrolyte flow pushes out gases and prevents void formation during deposition, significantly improving blind hole filling quality while using the existing electroplating device structure
Solution Approach 2:
The device prepares the blind holes for filling by first establishing proper electrolyte flow paths through the conduits before initiating metal deposition. This preliminary flow establishment ensures that gases are removed and the holes are ready for void-free filling, improving reliability without requiring separate preparation devices
3Manufacturing precision
If work piece is rotated during deposition, then deposition uniformity is improved, but the processing time increases
Solution Approach 1:
The device transitions from a static anode configuration to a dynamic one where anode segments can be independently positioned or adjusted. This allows the system to optimize deposition conditions for different substrate regions without requiring continuous rotation, maintaining uniformity while reducing processing time
Solution Approach 2:
The device changes the electrolyte flow parameters through the through-going conduits to achieve uniform deposition without mechanical rotation. By adjusting flow rate, flow distribution, and electrolyte composition locally, the system achieves the same uniformity effect as rotation but without the time penalty
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves uniform galvanic metal deposition on substrates and successfully fills blind holes without voids or gases, improving the uniformity and efficiency of metal layer formation across substrate surfaces.
Implementation Method 1
electroplated metals typically include copper, nickel, gold and lead... for creating the desired electrical potential at the surface of the work piece for effecting metal deposition
Implementation Method 2
electroplating solution... for creating the desired electrical potential at the surface of the work piece for effecting metal deposition
Implementation Method 3
electroplating solution directed about the periphery of the anode, and through a perforate diffuser plate... The electroplating solution flows through the diffuser plate, and against the associated work piece
Data Source
AI summary
A method and device for vertical galvanic metal deposition on a substrate, the device including at least first and second device elements arranged vertically parallel to each other, the first device element including at least a first anode element having a plurality of through-going conduits and at least a first carrier element having a plurality of through-going conduits, the at least first anode element and the at least first carrier element firmly connected to each other; and the second device element including at least a first substrate holder adapted to receive at least one substrate to be treated, the at least one substrate holder at least partially surrounding the at least one substrate along its outer frame after receiving it; the distance between the first anode element and the at least first substrate holder ranging from 2 to 15 mm.