Vertical Ground Contact for IC Testing

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Solution Overview

Problem

Current integrated circuit testing solutions struggle to accommodate smaller IC devices due to limited space for ground contacts, require lengthy assembly processes, and exert excessive gram force, leading to wear and tear on contact points.

Innovation Solution

A vertically oriented ground contact design with a rigid bottom member and flexible top member, featuring a compressible member for controlled gram force and quick assembly, allowing for efficient electrical connectivity in compact spaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional ground contact designs are used, then assembly is straightforward, but the ground contact occupies excessive space preventing testing of smaller IC devices

Engineering Contradiction:

Improveground contact sizeVSAvoidelectrical contact reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The ground contact transitions from a horizontal layout to a vertical orientation, utilizing the vertical dimension to reduce the horizontal footprint. The rigid bottom member extends upward and the flexible top member arches over to contact the IC device from above, effectively using vertical space to minimize the ground contact's horizontal occupation within the socket.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The flexible top member is designed as a thin, arching structure that can bend and conform to the IC device. This flexible component maintains reliable electrical contact through its ability to deform and adapt to the contact surface, ensuring continuity while occupying minimal space.

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If multiple assembly elements are used, then contact reliability is improved, but assembly time increases

Engineering Contradiction:

Improvecontact reliabilityVSAvoidassembly time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The rigid bottom member and flexible top member are combined into a single integrated ground contact assembly. This merging of components simplifies the assembly process by reducing the number of separate parts that need to be manually positioned and connected, while the integrated design ensures continuous reliable contact through the coordinated action of both members.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The flexible top member automatically adjusts and maintains contact with the IC device through its inherent elastic properties. Once assembled, the component self-regulates the contact pressure and positioning, eliminating the need for complex adjustment mechanisms or multiple assembly steps.

Inventive Principle:

Principle #25Self-service

3Reliability

If high gram force is exerted, then electrical contact is ensured, but wear and tear on contact points increases

Engineering Contradiction:

Improveelectrical contact qualityVSAvoidcontact point lifespan

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The gram force parameter is optimized to a minimal sufficient level rather than using excessive force. The flexible top member's elastic properties allow it to maintain reliable electrical contact at lower force levels compared to rigid contacts, reducing the mechanical stress on contact points while ensuring adequate electrical connectivity.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The flexible top member acts as a compliant contact element that can deform to match the IC device surface, distributing the contact force over a larger area and reducing peak stresses. This flexibility enables reliable contact at lower gram forces, thereby extending the lifespan of contact points.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables testing of smaller IC devices with increased mean time between assists and fracture, while reducing assembly time and wear on contact points through controlled gram force and enhanced electrical connectivity.

Implementation Method 1

a compressible member located between the narrower end of said bottom member and a bifurcation inner surface

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

said two arms having an inwards bias when clasped over the said bottom member, such that an inner surface of each arm is pressed in contact with each planar surface

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS9658248B2Ground contact of an integrated circuit testing apparatus

Publication Date: 2017.05.23 JF MICROTECH

AI summary

A ground electrical contact for an integrated circuit (IC) testing apparatus that comprises: a rigid bottom member having two planar surfaces that slope towards each other, so that the bottom member forms a partial wedge shape with the top end of the wedge being narrower than the bottom end; a flexible top member having two arms extending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm is pressed in contact with each planar surface; and a compressible member located between the narrower end of said bottom member and a bifurcation inner surface, which is an inner surface where the two arms bifurcate in the top member. The bottom member and top member are made of an electrically conductive material.