Vertical Hall Sensor Element With Non-Conductive Barrier Regions

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Solution Overview

Problem

Conventional vertical Hall sensor elements suffer from reduced sensitivity due to surface conductivity effects and production-related inhomogeneities, leading to significant offset signals and impaired measurement accuracy.

Innovation Solution

Incorporating non-conductive barrier regions, such as p-type well areas, between contact regions to redirect operating current deeper into the semiconductor substrate, combined with a poly semiconductor cap layer with adjustable bias voltage to compensate for offset signals and regulate sensitivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional vertical Hall sensor elements are used, then the structure is simple and easy to manufacture, but the sensitivity is reduced due to surface conductivity effects and offset signals increase

Engineering Contradiction:
ImprovesensitivityVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The sensor element is divided into functionally separated regions: non-conductive barrier regions (first regions) that redirect current away from the surface, and active sensing regions (second regions) that detect the Hall voltage. This segmentation allows current to be steered into deeper substrate paths, reducing surface conductivity effects and offset signals while maintaining measurement functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Non-conductive barrier regions act as intermediary structures that modify the current distribution pattern. These regions serve as mediators between the contact terminals and the active sensing areas, forcing the operating current to follow a deeper path through the substrate that avoids high-surface-conductivity zones, thereby reducing offset signals and improving sensitivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If non-conductive barrier regions are added to redirect current deeper into the substrate, then sensitivity improves and offset signals reduce, but device complexity increases

Engineering Contradiction:
Improvemeasurement accuracyVSAvoidstructural complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The sensor element incorporates regions with different local properties: non-conductive barrier regions with high resistance that redirect current, and active sensing regions with optimized conductivity for Hall voltage detection. This local differentiation allows each region to perform its specific function optimally, improving overall measurement accuracy while keeping the added complexity localized rather than global.

Inventive Principle:
Principle #3Local quality

3Measurement precision

If the active semiconductor region extends deeper into the substrate, then sensitivity improves, but power consumption increases due to higher resistance

Engineering Contradiction:
ImprovesensitivityVSAvoidpower consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The poly semiconductor cap layer with adjustable bias voltage provides dynamic control over the electrical properties of the active semiconductor region. By adjusting the bias voltage, the conductivity of the cap layer can be optimized to maintain low resistance paths for operating current while still allowing the active region to extend deeper into the substrate for improved sensitivity, thus balancing power consumption and measurement precision.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The bias voltage of the poly semiconductor cap layer is used as a controllable parameter to optimize the electrical characteristics of the sensor. By changing the bias voltage, the conductivity and thickness effect of the cap layer can be adjusted, allowing the system to achieve deep active region extension for sensitivity while maintaining acceptable power consumption through optimized electrical parameters.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the sensitivity of vertical Hall sensor elements while reducing power consumption and offset errors, resulting in more accurate magnetic field detection.

Implementation Method 1

non-conductive barrier regions, which extend from the main surface into the semiconductor region... designed to remove an operating current fed into the semiconductor region between two contact regions from the main surface

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Implementation Method 2

Hall sensor elements based on the Hall effect are used in technology, in addition to measuring a magnetic field according to magnitude and sign

Methodology Applied
Scientific EffectHall Effect: Hall Effect

Data Source

PatentEP1977460B1Vertical hall sensor element
Publication Date: 2009.06.24 FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
  • EP1977460B1 patent drawingFigure 1A~1B
  • EP1977460B1 patent drawingFigure 2A~2B
  • EP1977460B1 patent drawingFigure 3A~3B

AI summary

Disclosed is a vertical Hall sensor element (100) comprising a semiconductor substrate (102), a semiconductor area (104) that has a first type of conductivity and extends from a main surface (102a) of the semiconductor substrate (102) into the substrate (102), a plurality of contact areas (106a to e) on the main surface (102a) in the semiconductor area (104), and a plurality of non-conducting barrier areas (108a to d) which extend from the main surface (102a) into the semiconductor area (104), one of the non-conducting barrier areas being disposed between adjacent contact areas. The non-conducting barrier areas (108a to d) are configured so as to keep an operating current IH that is fed between two contact areas in the semiconductor area (104) away from the main surface (102a).