Vertically Mounted Hybrid Electronics for Avionics Space Reduction
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Solution Overview
Problem
Conventional electronics packaging on printed circuit boards in the avionics industry is inefficient in terms of space and weight utilization, as components are typically mounted horizontally, leading to increased surface area and weight requirements.
Innovation Solution
A hybrid electronics package is mounted vertically using a heat sink with ceramic substrates and outer covers, connected via lead terminations, allowing for reduced horizontal profile and weight by utilizing vertical space between circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If commercial-off-the-shelf electrical components are populated horizontally on the printed circuit board, then the electrical functionality is achieved, but the surface area and weight of the circuit board assembly increases
Solution Approach 1:
The patent transitions from horizontal mounting to vertical mounting of electronic hybrid assemblies on the circuit board. The assemblies extend vertically above the board surface, utilizing the third dimension (height) to achieve the desired electrical functionality while minimizing the horizontal footprint on the circuit board, thereby reducing the overall surface area required.
Solution Approach 2:
The patent divides the electronic functionality into separate modular hybrid assemblies that can be stacked or arranged vertically. Each assembly contains ceramic substrates and electronic components packaged together, allowing the system to achieve complex electrical functionality through modular segmentation rather than requiring a large planar arrangement of individual components.
2Adaptability or versatility
If additional electrical components are added to achieve desired functionality, then the functional capability is improved, but the weight of the assembly increases
Solution Approach 1:
The patent combines multiple electronic components, ceramic substrates, and housing elements into integrated hybrid assemblies. By merging these elements into compact modular units, the patent achieves the desired functional capability while minimizing the total weight compared to using separate mounted components.
Solution Approach 2:
The patent utilizes ceramic substrates within the hybrid assemblies, which provide both structural support and electrical functionality. The use of ceramic materials allows for compact, lightweight construction that achieves desired functionality without the weight penalty of traditional metal component assemblies.
3Ease of manufacture
If conventional horizontal mounting is used, then ease of manufacture is maintained, but space and weight efficiency is reduced
Solution Approach 1:
The patent maintains manufacturing simplicity by adapting standard assembly processes to vertical mounting configurations. The hybrid assemblies are manufactured as complete units and then mounted vertically to the circuit board using conventional attachment methods, thus preserving ease of manufacture while dramatically improving space efficiency through vertical utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the surface area and weight of circuit boards by over 75% while meeting mechanical, structural, electrical, and thermal requirements, enhancing space and weight efficiency in avionics environments.
Implementation Method 1
a first substrate fabricated from a ceramic material and contained within the first electronic hybrid assembly and connected to the heat sink, and a second substrate fabricated from a ceramic material and contained within the second electronic hybrid assembly and connected to the heat sink
Implementation Method 2
a heat sink having a center wall, the first electronic hybrid assembly and the second electronic hybrid assembly being mounted on opposing sides of the center wall from one another
Data Source
Figure 1~2
Figure 2A~2B
AI summary
A multi-hybrid module (14a, 14b) includes a plurality of hybrid assemblies (18a, 18b) that are perpendicularly mounted with respect to a plane of a circuit board (12a, 12b). The hybrid assemblies (18a, 18b) are mounted on opposing sides of a heat sink (22). The heat sink (22) has a first column (22a) disposed at a first end, a second column (22b) disposed at a second opposing end, and a generally flat center wall (22c) extending between the first column (22a) and the second column (22c) to which the hybrid assemblies (18a, 18b) are mounted. During operation the hybrid assemblies (18a, 18b) are mounted on edge perpendicular with respect to the circuit board (12a, 12b) to minimize an area profile of the multi-hybrid module (14a, 14b) on the circuit board (12a, 12b).