Vertical IC Integration With Backside Passive Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices face challenges in minimizing size while incorporating discrete passive components due to their external mounting on circuit boards, which increases device size and complexity.
Innovation Solution
A vertically integrated circuit system is developed, where discrete passive components are mounted on the back side of a semiconductor die and connected to an active layer via electrical paths such as thru silicon vias (TSVs), allowing for space-saving integration and customization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete passive components are mounted externally on circuit boards, then ease of manufacture and customization are improved, but device size and complexity increase
Solution Approach 1:
The patent merges discrete passive components with the semiconductor die by mounting them on the back side of the die and connecting them to active components through conductive vias. This integration eliminates the need for separate circuit board mounting, thereby reducing overall device size while maintaining manufacturing flexibility.
Solution Approach 2:
The patent utilizes the vertical dimension by mounting passive components on the back side of the semiconductor die, transitioning from a planar layout to a three-dimensional configuration. This allows components to be stacked vertically rather than spread out horizontally, significantly reducing the device footprint.
2Ease of operation
If discrete passive components are mounted externally on circuit boards, then ease of operation and customization are improved, but device complexity increases
Solution Approach 1:
By integrating passive components directly onto the semiconductor die, the patent reduces the number of separate parts and interconnections required. This merger simplifies the overall device architecture and reduces complexity while maintaining the ability to customize component values and configurations.
3Volume of moving object
If all circuit systems are integrated within single chips, then device size is reduced, but manufacturing capabilities are insufficient with modern techniques
Solution Approach 1:
The patent segments the circuit system into active components fabricated on the front side of the semiconductor die and passive components mounted on the back side. This segmentation allows each type of component to be manufactured using optimized processes while achieving high-level integration that reduces device size.
Solution Approach 2:
The patent employs preliminary action by pre-fabricating the semiconductor die with active components and preparing conductive vias before mounting the passive components. This sequential approach enables complex integration to be achieved through manageable manufacturing steps.
Data Source
Figure 1~2
Figure 3
Figure 4(a)
AI summary
An integrated circuit system, comprising: an active layer fabricated on a front side of a semiconductor die; an energy harvesting layer on a back side of the semiconductor die, the energy harvesting layer configured to convert at least one of heat and light into charge; and at least one electrical path configured to distribute the charge to supply power to a component in the integrated circuit system.