Vertical IC Packaging With Lateral Pads for Compact PCB Assembly
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Solution Overview
Problem
Integrated circuits, particularly sensors with a single, well-defined sensing axis, face challenges in manufacturing, cost, compactness, and heat dissipation when positioned vertically in a package.
Innovation Solution
A method for manufacturing a component with an integrated circuit arranged perpendicular to a fixing and connection face, involving forming aligned conductive pads on both faces of a support, encapsulating in resin, and cutting to expose lateral connection pads for easy attachment to a printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If an integrated circuit is positioned vertically in a package, then the surface area occupied on a printed circuit board is reduced, but the manufacturing complexity and difficulty increase
Solution Approach 1:
The patent transitions from traditional horizontal IC mounting to vertical mounting by forming conductive pads that extend perpendicular to the support surface. This dimensional change allows the IC to be mounted vertically on the PCB, reducing the surface area occupied while maintaining electrical connectivity through the vertical conductive paths.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the conductive pads on both faces of the support and pre-encapsulating the IC in resin before final assembly. This preliminary preparation of conductive structures and encapsulation simplifies the overall manufacturing process despite the vertical configuration, as these elements are created in advance rather than during complex assembly operations.
2Temperature
If an integrated circuit is positioned vertically in a package, then heat dissipation is improved, but the manufacturing process becomes more difficult
Solution Approach 1:
The vertical positioning of the IC enables improved heat dissipation by allowing thermal pathways to extend vertically through the conductive pads and resin encapsulation. The vertical orientation provides better thermal management compared to horizontal mounting, as heat can dissipate more effectively through the vertical conductive structures.
Solution Approach 2:
The resin encapsulation acts as an intermediary medium that facilitates both electrical connectivity and thermal management. The resin layers formed on both faces of the support provide a medium through which heat can be conducted from the IC to the conductive pads, while also providing mechanical protection and structural support for the vertical configuration.
3Quantity of substance
If an integrated circuit is positioned vertically in a package, then the number of lateral connection pads is doubled, but additional manufacturing steps are required
Solution Approach 1:
The vertical positioning of the IC creates lateral connection pads on both the top and bottom faces of the support, effectively doubling the number of available connection points. This is achieved by forming conductive pads that extend vertically and are accessible from both faces, enabling more connection options without requiring additional lateral space on the PCB.
Solution Approach 2:
The conductive pads serve multiple functions: they provide electrical connectivity, thermal management pathways, and mechanical support structures. The same vertical conductive structures that enable heat dissipation also serve as the lateral connection pads, eliminating the need for separate dedicated connection elements and reducing overall manufacturing complexity.
4Volume of moving object
If an integrated circuit is positioned vertically in a package, then compactness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The vertical configuration reduces the horizontal footprint of the package, improving compactness. By orienting the IC vertically and using conductive pads that extend perpendicular to the support, the package occupies less surface area on the PCB while maintaining all necessary electrical and thermal functions.
Solution Approach 2:
The conductive pads and resin encapsulation are formed in advance through preliminary manufacturing steps, establishing precise vertical alignment and positioning before final IC assembly. This pre-preparation of structural and conductive elements ensures accurate positioning with reduced precision requirements during the final mounting operation.
Data Source
Figure 1A~3B
Figure 4A~7B
Figure 8A~11B
AI summary
The invention relates to a method for manufacturing a component (CMP) encapsulating an integrated circuit (IC), comprising steps consisting of: fixing an integrated circuit on a support (SB) and connecting connection pads (CC) of the integrated circuit to connection pads (CP) of the support; forming a first set of aligned conductive pads (CP), extending perpendicular to the support, each of the pads being electrically connected to a respective connection pad of the connection pads of the integrated circuit; encapsulating the integrated circuit and the pads in a resin layer formed on the support; and cutting the support and the resin layer along a cutting plane passing through each of the pads, so as to form a lateral cutting face in which each of the pads has an exposed face, the exposed faces of the pads forming lateral connection pads of the component.