Vertical Inductor Package Substrate for Switching Noise Filtering
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Solution Overview
Problem
Incorporating inductors or coils within microelectronic device packages to address switching noise in DC-DC converters is challenging due to increased size and cost associated with discrete passive components and complex PCB substrates.
Innovation Solution
A multilayer package substrate with vertically integrated inductors formed by patterning conductor layers and connecting them through dielectric material, allowing for a compact and cost-effective integration of inductors within the package substrate alongside semiconductor dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If discrete passive inductors or coils are mounted to a system board, then switching noise can be filtered, but area and cost increase
Solution Approach 1:
The patent combines the inductor and semiconductor device into a single integrated package structure. The inductor windings are formed within the package substrate itself, and the semiconductor device is mounted adjacent to the inductor in the same package, eliminating the need for separate discrete inductor components on the PCB and reducing overall board area.
Solution Approach 2:
The inductor is nested within the package substrate structure, with windings formed in conductor layers that are embedded within the substrate. The semiconductor device is then mounted adjacent to this nested inductor structure, creating a compact integrated assembly that fits within a single package footprint.
2Object-affected harmful factors
If discrete passive inductors or coils are mounted to a system board, then switching noise can be filtered, but cost increases
Solution Approach 1:
The inductor and semiconductor device are manufactured as an integrated assembly in a single packaging process. The conductor layers forming the inductor are created using standard PCB fabrication processes, and the semiconductor device is mounted in the same package, eliminating the need for separate procurement and assembly steps for discrete inductors.
3Object-affected harmful factors
If inductors are placed in a module with packaged integrated circuit, then switching noise can be filtered, but module size increases
Solution Approach 1:
The inductor and semiconductor device are merged into a single package structure where the inductor windings are formed within the package substrate and the semiconductor device is mounted adjacent to it. This integration eliminates the need for separate inductor housing and mounting structures, reducing overall module volume.
4Object-affected harmful factors
If additional PCB substrates are used with spaced apart coil or inductor devices, then switching noise can be filtered, but device complexity increases
Solution Approach 1:
The inductor and semiconductor device are combined into a single package structure with the inductor windings formed in conductor layers within the package substrate. This integration eliminates the need for multiple separate PCB substrates and reduces the complexity of interconnections and mounting arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces package size and cost while maintaining effective noise filtering performance, comparable to discrete inductors, by integrating inductors directly into the microelectronic device package substrate, eliminating the need for additional PCB components.
Implementation Method 1
conductive vertical connection layers extending through the dielectric material
Implementation Method 2
vertical inductor is formed including a coil formed in a first one of the conductor layers and a second one of the conductor layers
Data Source
AI summary
An apparatus includes: a first conductor layer patterned into parallel strips having a first end and an opposite second end formed on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers extending through the dielectric material; a second conductor layer in the multilayer package substrate spaced from the first conductor layer, the second conductor layer patterned into parallel strips having a first end and a second end, the second conductor layer coupled to the first conductor layer by vertical connectors formed of the conductive vertical connection layers at the first end and the second end, and a semiconductor die mounted to the device side surface of the multilayer package substrate that is spaced from and coupled to the second conductor.