Vertically Coupled Inductors for Compact Substrate Power Splitting
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Solution Overview
Problem
Conventional semiconductor packages require substantial surface area due to two-dimensional power splitters, which inefficiently split energy between input and output inductors.
Innovation Solution
Implementing vertically coupled inductors in a substrate with solenoid loops formed from multiple metal layers and through-substrate vias, allowing for three-dimensional magnetic coupling and independent inductance of output inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If two-dimensional power splitters are used in conventional semiconductor packages, then the package can be manufactured with standard fabrication processes, but the surface area required is substantial and energy transfer efficiency is poor
Solution Approach 1:
The patent transitions from two-dimensional planar inductor layouts to three-dimensional vertically coupled inductors. The input inductor and output inductors are stacked at different vertical levels within the substrate, with magnetic coupling occurring through the substrate thickness. This vertical arrangement dramatically reduces the horizontal surface area required while maintaining manufacturability through standard TSV and metal layer fabrication processes.
2Ease of manufacture
If two-dimensional power splitters are used in conventional semiconductor packages, then the layout is simple and fabrication is straightforward, but energy transfer efficiency between inductors is poor
Solution Approach 1:
By stacking inductors vertically at different z-levels within the substrate and utilizing through-substrate vias for magnetic flux coupling, the patent achieves superior magnetic coupling efficiency compared to planar arrangements. The vertical coupling path through the substrate enables more effective energy transfer while the fabrication remains compatible with existing semiconductor processes for forming metal layers and TSVs.
3Area of stationary object
If vertically coupled inductors are implemented in substrate, then surface area is reduced and energy transfer efficiency is enhanced, but device structure becomes more complex
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides the mechanical support structure, acts as the magnetic coupling medium between vertically stacked inductors, and utilizes its thickness dimension for three-dimensional inductor placement. The through-substrate vias serve both as electrical interconnects and as pathways for magnetic flux coupling. This multi-functionality reduces the need for additional components and simplifies the overall device architecture despite the vertical complexity.
4Volume of stationary object
If vertically coupled inductors are implemented in substrate, then package size is reduced, but manufacturing process complexity increases
Solution Approach 1:
The patent utilizes the substrate thickness dimension to stack inductors vertically, reducing the horizontal footprint and overall package volume. The manufacturing process complexity is managed by leveraging existing semiconductor fabrication capabilities for forming multiple metal layers and through-substrate vias, integrating the vertical inductor coupling into standard fabrication flows rather than requiring entirely new manufacturing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the surface area required for power splitting operations by utilizing three-dimensional magnetic coupling, enhancing energy transfer efficiency and reducing package size.
Implementation Method 1
vertically coupled inductors in a substrate... allowing for three-dimensional magnetic coupling and independent inductance of output inductors
Data Source
AI summary
Disclosed are devices that incorporate vertically coupled inductors in a substrate. The device includes an input inductor and one or more output inductors. Energy from the input inductor is transferred to the output inductors through magnetic coupling. Input and output inductors are formed as three-dimensional loops within a substrate so that there are vertical couplings between the input and the output inductors.