Vertical Interconnect Components for Compact 3D Electronic Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for manufacturing electronic devices result in high costs, decreased reliability, and oversized package sizes due to limitations in producing reliable and consistent three-dimensional connection paths between electronic components.
Innovation Solution
The method involves forming vertical interconnect components using wafer processing capabilities, such as wafer molding and signal distribution structures, to create accurate, reliable, and economical features in the wafer plane, which are then rotated for use in electronic devices, enabling efficient manufacturing of electronic components and devices with improved connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods are used to manufacture electronic devices, then production can be performed with existing processes, but costs are high, reliability is decreased, and package sizes are oversized
Solution Approach 1:
The patent transitions from conventional planar manufacturing to three-dimensional connection paths by forming vertical interconnect components that extend in the vertical dimension. This allows reliable electrical connections between stacked electronic components while maintaining compact package sizes and reducing manufacturing complexity through wafer-level processing.
Solution Approach 2:
The patent forms vertical interconnect components and signal distribution structures during wafer processing before final device assembly. This preliminary formation of interconnect structures enables subsequent stacking and assembly operations to proceed with high reliability and precision, avoiding the need for complex post-assembly routing.
2Volume of stationary object
If conventional manufacturing processes are used, then existing equipment can be utilized, but package sizes become too large
Solution Approach 1:
The patent employs three-dimensional vertical interconnect components that stack electronic components in the vertical dimension rather than spreading them out in the planar dimension. This dimensional transition dramatically reduces package footprint while wafer-level processing ensures high manufacturing precision for the vertical connection paths.
Solution Approach 2:
The patent implements stacked arrangements of electronic components where multiple devices are vertically nested within a compact package structure. The vertical interconnect components penetrate through multiple stacked layers, enabling dense integration and small package size while maintaining precise electrical connections between nested components.
3Adaptability or versatility
If three-dimensional connection paths are formed using conventional methods, then connectivity can be achieved, but production costs increase and reliability decreases
Solution Approach 1:
The patent creates vertical interconnect components that serve multiple functions simultaneously: providing electrical connections, enabling thermal management pathways, and facilitating mechanical stacking alignment. This multi-functionality achieves versatile three-dimensional connectivity while streamlining manufacturing processes and improving production efficiency through single-step wafer-level operations.
Solution Approach 2:
The patent combines the formation of vertical interconnect components, signal distribution structures, and component alignment features into integrated wafer-level processing operations. This merging of multiple manufacturing steps into unified processes reduces production complexity, lowers costs, and improves reliability by minimizing the number of discrete operations required to achieve three-dimensional connectivity.
Data Source
AI summary
Electronic components and an electronic device comprising one or more of the electronic components, and a method of manufacturing the electronic components and an electronic device comprising one or more of the electronic components. As non-limiting examples, various aspects of this disclosure provide vertical interconnect components and various other vertical electronic components, and a method of manufacturing thereof, and an electronic device comprising one or more of the vertical interconnect components and various other vertical electronic components, and a method of manufacturing thereof.