Vertical Interconnect Core-Ball Stacking for Thicker Die Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic packages and manufacturing methods result in excessive costs, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The use of vertical interconnect structures comprising multiple metallic core balls stacked vertically and coupled by fusible material, which simplifies thermocompression bonding and allows for thicker dies, improving thermal performance while controlling joint height and fusible volume by selecting core ball diameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electronic packages and manufacturing methods are used, then manufacturing processes are established, but excess cost, decreased reliability, and large package sizes result
Solution Approach 1:
The interconnect structure is segmented into multiple metallic core balls stacked vertically rather than using a single large interconnect. This segmentation allows for better heat distribution and improved reliability while reducing overall package size and manufacturing complexity
Solution Approach 2:
The invention transitions from a planar arrangement of interconnects to a vertical three-dimensional stacking of metallic core balls. This dimensional change improves heat dissipation pathways, reduces package footprint, and enhances reliability without increasing manufacturing cost
2Temperature
If conventional interconnect structures are used, then manufacturing is simplified, but thermal performance is suboptimal due to inability to accommodate thicker dies
Solution Approach 1:
By stacking metallic core balls vertically in three dimensions, the invention creates extended thermal pathways that improve heat dissipation from thicker dies, directly addressing thermal performance without complicating the manufacturing process
Solution Approach 2:
The invention changes the structural parameters of the interconnect by using multiple stacked metallic core balls with specific diameter relationships, enabling accommodation of thicker dies and improved thermal performance while maintaining manufacturing simplicity
3Manufacturing precision
If artificial stretching steps are used in manufacturing, then joint height is achieved, but process complexity and costs increase
Solution Approach 1:
The metallic core balls are pre-formed with specific diameters and stacked in the desired configuration before bonding. This preliminary preparation eliminates the need for artificial stretching steps during manufacturing, simplifying the process while maintaining precise joint height control
Solution Approach 2:
By controlling the diameter parameters of the stacked metallic core balls, the invention achieves the desired joint height directly through the stacking arrangement, eliminating complex stretching processes and reducing manufacturing steps
4Volume of moving object
If larger package sizes are used, then component accommodation is improved, but performance decreases due to excessive size
Solution Approach 1:
The invention utilizes vertical stacking of metallic core balls to achieve the required component accommodation within a smaller footprint. This three-dimensional arrangement improves performance by reducing signal paths and parasitic effects while maintaining adequate space for thicker dies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal performance by accommodating thicker electronic components, reduces the need for artificial stretching steps, and maintains a similar interconnect pitch, thereby improving reliability and reducing costs.
Implementation Method 1
a fusible material coupling the first metallic core ball with the second metallic core ball
Implementation Method 2
simplifies thermocompression bonding
Data Source
AI summary
In one example, an electronic device can comprise a first substrate, an electronic component disposed over a side of the first substrate, and a vertical interconnect coupled to the side of the first substrate. The vertical interconnect can comprise a first metallic core ball proximate the first substrate, a second metallic core ball disposed above the first metallic core ball and distal from the first substrate, and a fusible material coupling the first metallic core ball with the second metallic core ball. The fusible material can be coupled to the first substrate. A second substrate can be disposed over the electronic component and the vertical interconnect. The fusible material of the vertical interconnect can be coupled to the second substrate. Other examples and related methods are also disclosed herein.