Vertical Interconnect Hub for Low-Latency Multi-Die Packaging
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Solution Overview
Problem
Legacy package assemblies for mobile electronic devices face challenges in reducing size while maintaining high-speed connections between dies, with existing solutions like EMIB and silicon interposers limited by size, cost, and latency, and prone to fabrication defects and yield issues.
Innovation Solution
The implementation of a vertical interconnect hub that provides direct, high-density die-to-die connectivity, reducing the number of interconnects needed and avoiding the use of passive interposers and through-silicon vias, allowing for more flexible and efficient communication between dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If EMIB or silicon interposer structures are used to provide die-to-die connectivity, then interconnect functionality is achieved, but device size increases and fabrication complexity increases
Solution Approach 1:
The patent transitions from planar EMIB interconnect structures to a vertical three-dimensional hub architecture. The hub is positioned vertically above the die tile complex, utilizing the Z-dimension to provide interconnect functionality without increasing the lateral footprint of the package assembly.
Solution Approach 2:
The patent segments the interconnect functionality into a separate hub component that is vertically positioned above the die tile complex. This hub contains the interconnect circuitry and is electrically coupled to multiple dies through vertical connections, separating the interconnect function from the die mounting plane.
2Reliability
If EMIB or silicon interposer structures are used to provide die-to-die connectivity, then interconnect functionality is achieved, but fabrication yield decreases due to defects
Solution Approach 1:
The hub is fabricated as a separate component from the dies, allowing independent optimization of each. The hub can be manufactured using standard semiconductor processes on smaller wafers, avoiding the need to fabricate large interposer substrates that are prone to defects.
Solution Approach 2:
The hub serves as an intermediary component that mediates connections between dies. Rather than requiring direct large-area interposer fabrication, the hub acts as a centralized connection point that can be electrically coupled to dies through controlled vertical interconnect structures.
3Reliability
If traditional interconnect structures are used, then die connectivity is established, but communication latency increases
Solution Approach 1:
The patent utilizes vertical three-dimensional interconnect paths through the hub, replacing long lateral signal paths with shorter vertical connections. This dimensional change reduces the physical distance signals must travel between dies, thereby reducing communication latency.
4Reliability
If high-density interconnect paths are implemented using traditional methods, then connectivity is achieved, but power consumption increases
Solution Approach 1:
By transitioning to vertical interconnect paths through the hub, the patent reduces the length of interconnect traces and the number of intermediate connection points. Shorter signal paths reduce resistive losses and dynamic power consumption associated with charging and discharging interconnect capacitance.
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
Embodiments herein relate to systems, apparatuses, or processes for an interconnect hub for dies that includes a first side and a second side opposite the first side to couple with three or more dies, where the second side includes a plurality of electrical couplings to electrically couple at least one of the three or more dies to another of the three or more dies to facilitate data transfer between at least a subset of the three or more dies. The three or more dies may be tiled dies.