Vertical Interconnect Module Thermal Management
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Solution Overview
Problem
Optical transceivers face performance degradation and heat management issues at elevated temperatures, limiting their operational efficiency and lifespan due to the mismatched thermal characteristics between VCSELs and integrated circuits, which affects data transmission rates and reliability.
Innovation Solution
A vertical interconnect module design with a compact optical engine and heat management system, where the optical engine is mounted on the bottom surface of the substrate, allowing for efficient heat dissipation and minimizing the module's footprint, while maintaining high data transmission rates through a low-profile and small footprint configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If VCSELs are operated at elevated temperatures to match IC operating conditions, then thermal management complexity is reduced, but VCSEL performance and lifetime are degraded
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional vertical heat management by mounting the optical engine on the bottom surface of the substrate. This allows heat to be dissipated in the vertical direction through dedicated heat sinks and thermal vias, separating the thermal management pathway from the electrical signal pathways and enabling independent optimization of VCSEL operating temperature
Solution Approach 2:
The patent segments the thermal management system into distinct components: the optical engine substrate, heat sinks, thermal vias, and cooling channels. This segmentation allows each component to be optimized for its specific thermal function while maintaining electrical isolation, enabling the VCSELs to operate at lower temperatures independent of the IC operating temperature
2Loss of energy
If the optical engine is mounted on the bottom surface of the substrate, then heat dissipation efficiency is improved, but the module footprint increases
Solution Approach 1:
The patent utilizes the vertical dimension by mounting the optical engine on the bottom surface of the substrate rather than the top surface. This three-dimensional arrangement allows heat to be dissipated vertically through heat sinks and thermal vias, improving heat dissipation efficiency without requiring additional horizontal space, thus maintaining a compact module footprint
Solution Approach 2:
The patent implements nested thermal management structures where thermal vias are embedded within the substrate, heat sinks are integrated into the substrate structure, and cooling channels are positioned within the housing. This nesting approach maximizes heat dissipation surface area and thermal conduction pathways within a compact footprint by utilizing vertical and internal spaces
3Device complexity
If IC and VCSEL are placed adjacent to each other, then device integration is improved, but temperature mismatch causes performance degradation
Solution Approach 1:
The patent segments the thermal management of the IC and VCSEL into independent systems. The VCSEL operates with its own dedicated heat sinks and thermal vias that conduct heat away from the VCSEL array, while the IC has separate thermal management pathways. This segmentation allows each component to maintain its optimal operating temperature despite being physically integrated in the same module
Solution Approach 2:
The patent introduces thermal vias and heat sink structures as intermediary elements between the VCSEL and the ambient environment. These intermediaries provide dedicated thermal conduction pathways that conduct heat away from the VCSEL before it can transfer to the IC or surrounding structures, thereby maintaining the temperature mismatch necessary for optimal VCSEL performance while allowing physical integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the operational efficiency and reliability of optical transceivers by effectively managing heat and maintaining high data transmission rates, even at elevated temperatures, thereby improving the overall performance and lifespan of the optical interconnect modules.
Implementation Method 1
The light source is typically a laser light source, such as a VCSEL (Vertical Cavity Surface Emitting Laser)
Implementation Method 2
The optical receiver typically includes one or more photodetectors that receive optical input signals, and convert the optical input signals to electrical signals
Implementation Method 3
optical transceivers typically include one or more heat transport and, or dissipation members that are in thermal communication with one or more heat producing elements and transfer the heat to the periphery of the transceiver housing
Data Source
AI summary
A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.