Electronic devices and methods of manufacturing electronic devices
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Solution Overview
Problem
Existing electronic packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, and relatively low performance with large package sizes.
Innovation Solution
The proposed electronic device includes a substrate, electronic component, vertical interconnects, thermal body, interposer, and encapsulant, with specific manufacturing processes that enhance electrical and thermal management, such as wafer-to-wafer bonding and use of dielectric materials for structural support and signal distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electronic packages are used, then manufacturing is simpler, but cost increases and reliability decreases
Solution Approach 1:
The electronic package is divided into multiple functional layers including substrate, interposer, encapsulant, and thermal management components. Each layer performs specific functions independently, allowing for optimized manufacturing of each segment while maintaining overall reliability through their integrated assembly.
Solution Approach 2:
The package structure employs nested arrangements where the interposer is embedded within the encapsulant, vertical interconnects are positioned within the substrate, and thermal management components are integrated within the package cavity. This nesting reduces overall package size while maintaining structural integrity and reliability.
2Volume of moving object
If conventional packaging methods are used, then manufacturing process is simpler, but package size becomes too large
Solution Approach 1:
The package design transitions from planar expansion to vertical integration by stacking functional layers (substrate, interposer, encapsulant) in the vertical dimension. This allows the package to maintain compact footprint while accommodating complex interconnections and thermal management features through vertical arrangement.
Solution Approach 2:
Multiple functions are merged into single components: the interposer provides both electrical interconnection and structural support, the encapsulant provides both protection and thermal pathways, and the thermal body integrates heat dissipation with structural function. This merging reduces the number of discrete components and overall package volume.
3Reliability
If conventional interconnection methods are used, then manufacturing is easier, but electrical connectivity performance deteriorates
Solution Approach 1:
The interconnection structure employs different materials and geometries at different locations: copper pillars with specific diameters and spacings are used in high-density areas, while larger pitch areas use different interconnect configurations. The interposer materials are selectively chosen to optimize signal integrity in different regions, improving overall electrical connectivity through localized optimization.
Data Source
AI summary
In one example, an electronic device includes a substrate having a conductive structure, an electronic component coupled to the conductive structure at a first side of the substrate, wherein the electronic component includes a first side facing the first side of the substrate and a second side opposite the first side, vertical interconnects disposed around the electronic component, wherein the vertical interconnects are coupled to the conductive structure at the first side of the substrate, a thermal body coupled to the second side of the electronic component, an interposer coupled to the vertical interconnects, wherein the interposer includes inner sidewalls defining an opening disposed around the thermal body, and an encapsulant disposed between the thermal body and the inner sidewalls of the interposer, around the vertical interconnects, and around the electronic component, wherein the thermal body is exposed from the encapsulant. Other examples and related methods are also disclosed herein.